Compositions Including a High Molecular Weight Acid Suitable for Conductive Polymer Formation on Dielectric Substrate

Patent metadata

Field	Value
Publication number	US-2018002541-A1
Application number	US-201615545208-A
Country	US
Kind code	A1
Filing date	Jan 20, 2016
Priority date	Oct 31, 2011
Publication date	Jan 4, 2018
Grant date	—

Abstract

The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.

First claim

1 . A composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising:
at least one polymerizable monomer which is capable of forming a conductive polymer, an emulsifier, and an acid, wherein the composition comprises at least one metallic or nitrogenous ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, B x O y -anions, indium-ions, and alkylimidazolium-ion, and wherein the acid is a polymeric acid having a molecular weight of at least 500,000 Da.

2 . The composition according to claim 1 wherein the polymeric acid has a molecular weight of at least about 600,000 Da.

3 . The composition according to claim 1 wherein the polymeric acid has a molecular weight of between about 500,000 Da and about 1,500,000 Da.

4 . The composition according to claim 1 , wherein the acid comprises at least one acid and/or a salt of an acid selected from the group consisting of sulfuric acid, sulfonic acid, alky sulfonic acid, polymeric sulfonic acid, polystyrene sulfonic acid, polyphosphoric acid, isethionic acid, sulfosuccinic acid, aryl sulfonic acid, p-toluene sulfonic acid.

5 . The composition according to claim 4 wherein the acid comprises a polymeric sulfonic acid.

6 . The composition according to claim 5 wherein the polymeric sulfonic acid comprises a poly(vinylaryl)sulfonic acid.

7 . The composition according to claim 6 wherein the acid is polystrene sulfonic acid.

8 . The composition according to claim 7 wherein polystyrene sulfonic acid is incorporated into the composition in the form of the sodium salt.

9 . The composition according to claim 8 wherein the sodium salt of polystyrene sulfonic acid provides substantially all of the at least one metallic or nitrogenous ion of the composition.

10 . The composition according to claim 1 , wherein the metallic or nitrogenous ion is selected from the group consisting of lithium-ions and sodium-ions, in a concentration between 0.001 mol/L and the solubility limit.

11 . The composition according to claim 1 , wherein the polymerizable monomer is a heterocyclic aromatic molecule having the structure:

wherein: X is O, S, or N; and R1 and R2 are each independently hydrogen, a halogen, a substituted or unsubstituted alky group having from 1 to 8 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 8 carbon atoms.

12 . The composition according to claim 1 , wherein the concentration of the emulsifier in the composition is in a range between 0.1 mL/L to 200 mL/L.

13 . The composition according to claim 1 , further comprising at least one solvent selected from the group consisting of water, methanol, ethanol, n-propanol, isopropanol, higher alcohols, polyalcohols, dimethyl formamide, methylethylketone, cumene sulfonate, N-methyl pyrrolidone, Triglyme, Diglyme, and alkali metal salts of toluene sulfonates or their ethyl esters.

14 . The composition according to claim 1 , further comprising a source of cations for the electrolytic deposition of a metal.

15 . The composition according to claim 1 , wherein the emulsifier is a nonionic surfactant.

16 . The composition according to claim 15 wherein the nonionic surfactant is an alkoxylated aralkylphenol.

17 . The composition according to claim 16 wherein the nonionic surfactant is an ethoxylated tristyrylphenol.

18 . The composition according to claim 1 , wherein the emulsifier is an anionic polyarylphenolalcoxylate or a salt of a polyarylphenolalcoxylate.

19 . The composition according to claim 1 , wherein the emulsifier is selected from the group consisting of a salt of a sulfoalkylated polyalkoxylated naphthol or an aralkyl substituted sulfo polyalkoxylated phenol.

20 . The composition as set forth in claim 19 wherein the emulsifier is a compound having a molecular structure according to the following formula:

poly(oxy-1,2-ethanediyl) alpha.-sulfo-.omega.-[bis(1-phenylethyl)phenoxy]-ammonium salt.

21 . A composition as set forth in claim 1 , comprising an emulsifier corresponding to the structural formula:

22 . A composition as set forth in claim 1 , further comprising manganese ions.

23 . A method for metalizing a surface of a dielectric substrate by deposition of a metal, the method comprising:
immersing the substrate into a composition comprising:
at least one polymerizable monomer which is capable of forming a conductive polymer,
an emulsifier, and
an acid,
wherein the composition comprises at least one metallic or nitrogenous ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, B x O y -anions, indium-ions, and alkylimidazolium-ion, and
wherein the acid is a polymeric acid having a molecular weight of at least 500,000 Da, to form an electrically conductive polymer on the surface of the dielectric substrate; and
depositing a metal over said electrically conductive polymer.

Assignees

• Macdermid Enthone Inc

Inventors

• Rietmann Christian
• Glöckner Andreas

Classifications

• C25D3/38

  of copper · CPC title

• H05K3/426

  initial plating of through-holes in substrates without metal · CPC title

• H05K2201/0329

  Intrinsically conductive polymer [ICP]; Semiconductive polymer · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C09D5/44 Primary

  for electrophoretic applications (processes for coating by electrophoresis C25D13/00) · CPC title