Laser diode and method of manufacturing laser diode

Patent metadata

Field	Value
Publication number	US-2017358902-A1
Application number	US-201715407530-A
Country	US
Kind code	A1
Filing date	Jan 17, 2017
Priority date	Jun 9, 2016
Publication date	Dec 14, 2017
Grant date	—

Abstract

A laser diode includes a ridge portion, channel portions located adjacent to the ridge portion such that the ridge portion is sandwiched, the channel portions being shorter in height than the ridge portion, terrace portions adjacent to opposite sides of the respective channel portions from the ridge portion and longer in height than the channel portions, supporting portions provided over the respective channel portions, separated from side surfaces of the ridge portion or side surfaces of terrace portions or both, and made of resin, a ceiling portion including first portions provided over the supporting portions and second portions continuous with the first portions and located over the respective channel portions with hollow portions interposed therebetween, the ceiling portion being made of resin, and a metal layer provided over the ceiling portion and connected to an upper surface of the ridge portion.

First claim

What is claimed is:

1 . A laser diode comprising:
a ridge portion raised in a stripe shape; channel portions located adjacent to the ridge portion such that the ridge portion is sandwiched therebetween, the channel portions being shorter in height than the ridge portion; terrace portions adjacent to opposite sides of the respective channel portions from the ridge portion and longer in height than the channel portions; supporting portions provided over the respective channel portions, separated from respective adjacent side surfaces of the ridge portion or side surfaces of the respective adjacent terrace portions or both, and made of resin; a ceiling portion including first portions provided over the respective supporting portions and second portions continuous with the respective first portions and located over the respective channel portions with hollow portions interposed therebetween, the ceiling portion being made of resin; and a metal layer provided over the ceiling portion and connected to an upper surface of the ridge portion.

2 . The laser diode according to claim 1 , wherein the ceiling portion includes third portions provided to be continuous with the respective first portions or the respective second portions and provided over the respective terrace portions.

3 . The laser diode according to claim 1 , wherein each of the supporting portions is separated from both the adjacent side surface of the ridge portion and the side surface of the adjacent terrace portion.

4 . The laser diode according to claim 1 , further comprising:
buried portions made of resin and provided over each of the channel portions to be respectively connected to opposite ends of the corresponding supporting portion in planar view and contact both the adjacent side surface of the ridge portion and the side surface of the adjacent terrace portion, wherein the ceiling portion includes fourth portions provided over the respective buried portions to be continuous with the first portions or the second portions.

5 . The laser diode according to claim 4 , wherein the buried portions are provided along end faces of the laser diode.

6 . The laser diode according to claim 4 , wherein the buried portions are provided inward from end faces of the laser diode.

7 . The laser diode according to claim 1 , wherein the supporting portions contact the side surfaces of the ridge portion, respectively.

8 . The laser diode according to claim 1 , wherein each of the supporting portions includes a portion contacting the adjacent side surface of the ridge portion and a portion contacting neither the adjacent side surface of the ridge portion nor the side surface of the adjacent terrace portion.

9 . The laser diode according to claim 1 , wherein the ceiling portion is provided over the channel portions but not provided over the terrace portions.

10 . The laser diode according to claim 1 , wherein the terrace portions are made of resin.

11 . The laser diode according to claim 2 , wherein the metal layer is provided over one of the terrace portions but not provided over the other of the terrace portions.

12 . The laser diode according to claim 1 , wherein each of the supporting portions includes a plurality of separate portions formed along a resonator length direction.

13 . The laser diode according to claim 1 , wherein
the supporting portions are provided to surround, in planar view, a region in which the metal layer contacts the ridge portion, and the ceiling portion seals a space surrounded by the supporting portions.

14 . A method of manufacturing a laser diode, comprising the steps of:
forming resin in portions of channel portions of a laser structure to form hollow portions sealed with the laser structure and the resin, the laser structure including a ridge portion raised in a stripe shape, the channel portions having the ridge portion sandwiched therebetween and being shorter in height than the ridge portion, and terrace portions adjacent to opposite sides of the respective channel portion from the ridge portion and longer in height than the channel portions; forming a metal layer contacting an upper surface of the ridge portion over the resin; and patterning the metal layer using resist.

15 . The method according to claim 14 , wherein
the resin includes supporting portions contacting the respective channel portions and a ceiling portion provided over the supporting portions to serve as a ceiling of the hollow portions, and the ceiling portion includes portions provided over the terrace portions, and the metal layer is patterned to form pad electrodes over the terrace portions.

16 . The method according to claim 14 , wherein
the resin includes:
supporting portions provided over the respective channel portions and separated from respective adjacent side surfaces of the ridge portion or side surfaces of the respective adjacent terrace portions or both;
buried portions provided over each of the channel portions to be respectively connected to opposite ends of the corresponding supporting portion in planar view and contact both the adjacent side surface of the ridge portion and the side surface of the adjacent terrace portion; and
a ceiling portion supported by the supporting portions and the buried portions to serve as a ceiling of the hollow portions.

17 . A method of manufacturing a laser diode, comprising the steps of:
forming supporting portions made of resin in portions of channel portions of a laser structure, the laser structure including a ridge portion raised in a stripe shape, the channel portions having the ridge portion sandwiched therebetween and being shorter in height than the ridge portion, and terrace portions adjacent to opposite sides of the respective channel portion from the ridge portion and longer in height than the channel portions, the supporting portions being separated from respective adjacent side surfaces of the ridge portion or side surfaces of the respective adjacent terrace portions or both; forming a ceiling portion supported by the supporting portion and the ridge portion and made of resin by any one of laminating and STP to form hollow portions between the ceiling portion and the channel portions; and forming a metal layer contacting an upper surface of the ridge portion over the ceiling portion.

18 . The method according to claim 17 , wherein the supporting portions contact the respective adjacent side surfaces of the ridge portion.

Assignees

• Mitsubishi Electric Corp

Inventors

• Maeda Kazuhiro
• Minami Masafumi
• Nakamura Naoki
• Morita Daisuke

Classifications

• H01S5/22

  having a ridge or stripe structure · CPC title

• H01S5/2231

  with inner confining structure only between the active layer and the upper electrode · CPC title

• H01S5/04254

  characterised by the shape · CPC title

• H01S2301/176

  Specific passivation layers on surfaces other than the emission facet · CPC title

• H01S5/2205 Primary

  comprising special burying or current confinement layers · CPC title