Module stacking mechanism with integrated ground

Patent metadata

Field	Value
Publication number	US-2017345803-A1
Application number	US-201615163197-A
Country	US
Kind code	A1
Filing date	May 24, 2016
Priority date	May 24, 2016
Publication date	Nov 30, 2017
Grant date	—

Abstract

Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection. The first and second mounting holes located at opposite ends of the third projection. The second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a PCB, and the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

First claim

1 . An apparatus comprising:
a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection, the first and second mounting holes located at opposite ends of the third projection; wherein the second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a printed circuit board (PCB), wherein the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

2 . The apparatus of claim 1 , wherein the first projection is adjacent to a first side of the first mounting hole, the second projection is adjacent to a second side of the first mounting hole that is substantially opposite to the first side, and the third projection is adjacent to a third side of the first mounting hole and is substantially perpendicular to the first and second projections.

3 . The apparatus of claim 1 , wherein the first and second mounting holes and the first, second, and third projections comprise a unitary structure, the unitary structure comprising a module stacking mechanism with integrated ground.

4 . The apparatus of claim 1 , further comprising a fourth projection located below and circumferential to the second mounting hole, the fourth projection having a height to cause positioning of the top IC module above the bottom IC module.

5 . The apparatus of claim 4 , wherein one or more of the first mounting hole, the first projection, the second projection, and the fourth projection to cause a spacing between the top and bottom IC modules.

6 . The apparatus of claim 1 , wherein the top IC module and the PCB are substantially parallel to each other.

7 . The apparatus of claim 1 , wherein a length of the third projection is approximately equal to a distance from the connection structure to an edge of the top IC module closest to the first mounting hole.

8 . The apparatus of claim 7 , wherein the length of the third projection is approximately equal to a distance between pins located at edges of the top and bottom IC modules that are opposite to the edge of the top IC module closest to the connection structure.

9 . A method comprising:
coupling first ends of a bottom integrated circuit (IC) module and a top IC module to a bottom module connector and a top module connector, respectively, wherein the bottom and top module connectors are electrically coupled to a printed circuit board (PCB), and wherein the top IC module is stacked above the bottom IC module; coupling a second end, that is opposite to the first end, of the top IC module to a first mounting hole of a unitary module stacking mechanism; coupling a second end, that is opposite to the first end, of the bottom IC module to a second mounting hole of the unitary module stacking mechanism; and coupling the unitary module stacking mechanism to a single hole included in the PCB.

10 . The method of claim 9 , wherein coupling the second end of the top IC module to the first mounting hole comprises securing and electrically coupling the top IC module to the unitary module stacking mechanism.

11 . The method of claim 10 , wherein electrically coupling the top IC module to the unitary module stacking mechanism comprises establishing an electrical ground path between the top IC module and the PCB.

12 . The method of claim 11 , wherein coupling the unitary module stacking mechanism to the single hole included in the PCB comprises securing and establishing an electrical ground path for the top and bottom IC modules to the PCB.

13 . The method of claim 9 , wherein coupling the second end of the bottom IC module to the second mounting hole comprises attaching a fastener in the second mounting hole, wherein one or both of a portion of the unitary module stacking mechanism adjacent to the second mounting hole or the fastener electrically couples to a grounding contact area included in the second end of the bottom IC module.

14 . A computer device comprising:
a printed circuit board (PCB) including an electrical grounding structure; a top integrated circuit (IC) module; a bottom IC module stacked below the top IC module; a module stacking mechanism coupled to the top and bottom IC modules and to the electrical grounding structure; and a first mounting apparatus coupled to the module stacking mechanism, the electrical grounding structure, and the bottom IC module, wherein the first mounting apparatus comprises a fastener that inserts into the module stacking mechanism and the electrical grounding structure, and an electrical grounding path exists between the top IC module and the PCB and between the bottom IC module and the PCB.

15 . (canceled)

16 . (canceled)

17 . The computer device of claim 14 , further comprising a second mounting apparatus coupled to the module stacking mechanism and the top IC module.

18 . The computer device of claim 14 , wherein the module stacking mechanism comprises metallic or conductive material.

19 . The computer device of claim 14 , wherein the top and bottom IC modules comprise solid state drive (SSD) modules.

20 . The computer device of claim 19 , wherein a memory capacity associated with the top IC module is the same or different than a memory capacity associated with the bottom IC modules.

21 . The computer device of claim 14 , wherein the top and bottom IC modules are the same size relative to each other.

22 . The computer device of claim 14 , wherein the top and bottom IC modules are different sizes relative to each other.

23 . The computer device of claim 14 , wherein the module stacking mechanism maintains a gap distance between the top and bottom IC modules.

24 . The computer device of claim 14 , wherein the module stacking mechanism includes a pair of projections in contact with an edge of the top IC module, the pair of projections to stabilize positioning of the top IC module relative to the bottom IC module, to prevent rotation of the top IC module relative to the module stacking mechanism, or to automatically align a mounting hole included in the module stacking mechanism with the electrical grounding structure.

25 . An apparatus comprising:
a first means for coupling; first, second, and third means for supporting radiating from the first means for coupling; and a second means for coupling adjacent to the third means for supporting, the first and second means for coupling located at opposite ends of the third means for supporting; wherein the second means for coupling to cause an electrical coupling of a bottom integrated circuit (IC) module to a means for electrical grounding included in a printed circuit board (PCB), wherein the first means for coupling, the first means for supporting, and the second means for supporting to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the means for electrical grounding.

26 . The apparatus of claim 25 , wherein the first means for supporting is adjacent to a first side of the first means for coupling, the second means for supporting is adjacent to a second side of the first means for coupling that is substantially opposite to the first side, and the third means for supporting is ad

Assignees

• Intel Corp

Inventors

• Tate Alan W
• Thompson Andrew F

Classifications

• H10W90/291

  characterised by containers, encapsulations, or other housings for the stacked chips · CPC title

• H10W72/801

  Interconnections on sidewalls of containers · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K2201/10409

  Screws · CPC title