Plasma processing method

Patent metadata

Field	Value
Publication number	US-2017338084-A1
Application number	US-201715598463-A
Country	US
Kind code	A1
Filing date	May 18, 2017
Priority date	May 23, 2016
Publication date	Nov 23, 2017
Grant date	—

Abstract

A plasma processing method is implemented by a plasma processing apparatus including a processing chamber, a lower electrode, a focus ring arranged around the lower electrode, an inner upper electrode arranged to face the lower electrode, an outer upper electrode electrically insulated from the inner upper electrode, a quartz member arranged between the inner and outer upper electrodes and above the focus ring, a gas supply unit for supplying gas to the processing chamber, a first high frequency power supply unit for applying a first high frequency power for plasma generation to the lower electrode or the inner and outer upper electrodes, a first direct current power supply unit for applying a variable first direct current voltage to the outer upper electrode, and a control unit. The method includes the control unit controlling the variable first direct current voltage to reduce an amount of change in a tilt angle.

First claim

What is claimed is

1 . A plasma processing method implemented by a plasma processing apparatus including
a processing chamber capable of being evacuated; a lower electrode on which a substrate to be processed in the processing chamber is mounted; a focus ring arranged around the lower electrode; an inner upper electrode arranged to face the lower electrode in the processing chamber; an outer upper electrode that is electrically insulated from the inner upper electrode and is arranged at an outer periphery of the inner upper electrode in the processing chamber; a quartz member arranged between the inner upper electrode and the outer. upper electrode and above the focus ring; a gas supply unit for supplying a processing gas to a processing space between the lower electrode and the inner and outer upper electrodes; a first high frequency power supply unit for applying to the lower electrode or the inner and outer upper electrodes, a first high frequency power for generating a plasma of the processing gas by high frequency discharge; a first direct current power supply unit for applying a variable first direct current voltage to the outer upper electrode; and a control unit for controlling the variable first direct current voltage; the plasma processing method comprising a step of the control unit controlling the variable first direct current voltage to reduce an amount of change in a tilt angle.

2 . The plasma processing method according to claim 1 , wherein
the tilt angle is an angle formed between a line extending in a vertical direction of a hole formed in the substrate and a line passing through a top center point of a top diameter of a cross-sectional opening of the hole and a bottom center point of a bottom diameter of a bottom section of the hole.

3 . The plasma processing method according to claim 1 ,
wherein the plasma processing apparatus further includes a second direct current power supply unit for applying a variable second direct current voltage to the inner upper electrode; and wherein the plasma processing method comprises a step of controlling the variable second direct current voltage applied to the inner upper electrode.

4 . The plasma processing method according to claim 1 , wherein
the control unit refers to a storage unit that associates a process to be executed with an allowable tilt angle and controls the variable first direct current voltage to reduce the amount of change in the tilt angle and control the tilt angle to be within the allowable tilt angle associated with the process to be executed.

Assignees

• Tokyo Electron Ltd

Inventors

• Nishijima Takashi

Classifications

• H10P74/00

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H01J37/32568

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J37/3299

  Feedback systems · CPC title

• H01J37/32642 Primary

  Focus rings · CPC title