Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device

Patent metadata

Field	Value
Publication number	US-2017332489-A1
Application number	US-201515533195-A
Country	US
Kind code	A1
Filing date	Dec 11, 2015
Priority date	Dec 12, 2014
Publication date	Nov 16, 2017
Grant date	—

Abstract

According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm 3 to 12000 precipitates/μm 3 ; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

First claim

1 . An oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> copper crystal axis, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm 3 to 12000 precipitates/μm 3 .

2 . The oriented copper plate according to claim 1 , which further contains one or two or more of: Mn: not more than 0.4% by mass; Al: not more than 0.4% by mass; Ti: not more than 0.2% by mass; Zr: not more than 0.2% by mass; and rare earth elements: not more than 0.4% by mass.

3 . The oriented copper plate according to claim 1 , which further contains one or two of: P: less than 0.01% by mass; and Zn: less than 0.1% by mass.

4 . The oriented copper plate according to claim 1 , which further contains, at a total concentration of less than 0.03% by mass, one or two or more selected from the group consisting of: Ag, Sn, Pd, Ni, Fe, B, Si, Ca, V, Co, Ga, Ge, Sr, Nb, Mo, Rh, Ba, W, and Pt.

5 . A copper-clad laminate, which has an insulating layer formed on a surface of the oriented copper plate according to claim 1 .

6 . The copper-clad laminate according to claim 5 , wherein the oriented copper plate has a thickness of 5 μm to 18 μm, and the insulating layer is composed of a resin and has a thickness of 5 μm to 75 μm.

7 . The copper-clad laminate according to claim 6 , wherein the resin is composed of polyimide.

8 . A flexible circuit board, which has a certain wiring formed on the oriented copper plate of the copper-clad laminate according to claim 5 , which further has a bending portion at least one site of the wiring in a direction orthogonal to a specific in-plane direction of the copper plate.

9 . The flexible circuit board according to claim 8 , wherein the bending portion is a bending portion which conducts one or two or more repetitive actions selected from the group consisting of lock seaming bending, rotary slide bending, folding bending, hinge bending, and lateral slide bending.

10 . An electronic device, which is equipped with the flexible circuit board according to claim 8 .

Assignees

• Nippon Steel & Sumitomo Metal Corp

Inventors

• Kimura Keiichi
• Uno Tomohiro
• Kaneko Kazuaki

Classifications

• H01B1/026

  Alloys based on copper · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title