Printed circuit board, method for manufacturing printed circuit board, and method for joining conductive member

Patent metadata

Field	Value
Publication number	US-2017325338-A1
Application number	US-201515522207-A
Country	US
Kind code	A1
Filing date	Oct 29, 2015
Priority date	Oct 29, 2014
Publication date	Nov 9, 2017
Grant date	—

Abstract

Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.

First claim

1 . A method for joining a conductive member, comprising:
a placement state holding process of holding a placement state of the conductive member in such a manner that an upper surface of the conductive member placed on each of a plurality of conductive joint portions with preliminary solders applied thereto and the preliminary solder are covered with an optically-transparent sheet having an adhesive layer; and a joint process of joining the conductive joint portion and the conductive member together by heating and melting the preliminary solder by light irradiation of the conductive joint portion and the conductive member through the optically-transparent sheet.

2 . A method for manufacturing a printed circuit board, comprising:
a conductive member setting process of placing a conductive member on each of a plurality of conductive joint portions with preliminary solders applied thereto; a placement state holding process of holding a placement state of the conductive member in such a manner that an upper surface of the conductive member and the preliminary solder are covered with an optically-transparent sheet having an adhesive layer; and a joint process of joining the conductive joint portion and the conductive member together by heating and melting the preliminary solder by light irradiation of the conductive joint portion and the conductive member through the optically-transparent sheet.

3 . The method for manufacturing the printed circuit board according to claim 2 , wherein
the optically-transparent sheet is made of polyimide resin.

4 .- 6 . (canceled)

7 . The method for manufacturing the printed circuit board according to claim 2 , further comprising:
an optically-transparent sheet removal process of removing the optically-transparent sheet after the joint process, wherein a portion of the conductive member is exposed at the optically-transparent sheet removal process.

8 . The method for manufacturing the printed circuit board according to claim 3 , further comprising:
an optically-transparent sheet removal process of removing the optically-transparent sheet after the joint process, wherein a portion of the conductive member is exposed at the optically-transparent sheet removal process.

Assignees

• Tatsuta Electric Wire & Cable Co Ltd

Inventors

• Aoyagi Yoshihiko
• Kawakami Yoshinori
• Hirano Yoshio
• Urashita Kiyotaka
• Fujikawa Ryota
• Fujio Nobuhiro

Classifications

• H05K2203/0278

  Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive · CPC title

• B23K2101/42

  Printed circuits · CPC title

• H05K2203/049

  Wire bonding · CPC title

• H05K3/34

  by soldering · CPC title

• H05K2203/0147

  Carriers and holders · CPC title