Polymer compound, surface treatment agent, laminated body using surface treatment agent, transistor, method for manufacturing laminated body

Patent metadata

Field	Value
Publication number	US-2017321079-A1
Application number	US-201715659838-A
Country	US
Kind code	A1
Filing date	Jul 26, 2017
Priority date	Apr 10, 2015
Publication date	Nov 9, 2017
Grant date	—

Abstract

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula ( 1 ). [In formula ( 1 ), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]

First claim

1 . A polymer compound comprising a constituent unit represented by the following formula (1).

[in the formula (1), R 1 represents hydrogen or a methyl group, m represents an integer of 2 to 20, and Q represents a photosensitive leaving group]

2 . The polymer compound according to claim 1 , wherein Q is at least one group represented by the following formula (2).

[in the formula (2), R 2 represents hydrogen or an alkyl group, R 3 and R 4 each independently represent an alkyl group or a fluoroalkyl group including a methyl group, and R 5 represents hydrogen or a nitro group]

3 . The polymer compound according to claim 1 , wherein the compound represented by the formula (1) has a number average molecular weight of 1000 to 5000.

4 . The polymer compound according to claim 1 , comprising no alkoxysilane.

5 . The polymer compound according to claim 1 , wherein at least one terminal of the compound represented by the formula (1) comprises a substitute represented by the following general formula (13).

6 . The polymer compound according to claim 1 , wherein terminals of the compound represented by the formula (1) comprise substitutes represented by the following formula (14) and the following formula (15).

7 . The polymer compound according to claim 1 , wherein terminals of the compound represented by the formula (1) comprise substitutes represented by the following formula (16) and the following formula (17).

8 . A surface treatment agent comprising the polymer compound according to claim 1 .

9 . A laminated body comprising the surface treatment agent according to claim 8 .

10 . A transistor comprising the surface treatment agent according to claim 8 .

11 . The method for manufacturing a laminated body, the method comprising the steps of: forming a photosensitive polymer layer by applying the surface treatment agent according to claim 8 ; exposing the photosensitive polymer layer to predetermined pattern light; providing a catalyst for electroless plating on the exposed region of the photosensitive polymer layer; and bringing the photosensitive polymer layer into contact with an electroless plating solution, thereby carrying out electroless plating.

Assignees

• Nikon Corp

Inventors

• Kawakami Yusuke
• Koizumi Shohei
• Sugizaki Takashi

Classifications

• C23C18/30

  Activating {or accelerating or sensitising with palladium or other noble metal} · CPC title

• C08F120/36

  containing oxygen in addition to the carboxy oxygen {, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate} · CPC title

• C23C18/36

  using hypophosphites · CPC title

• C23C18/1608

  from pretreatment step, i.e. selective pre-treatment · CPC title

• C23C18/20

  of organic surfaces, e.g. resins · CPC title