Method for producing electrical wiring member and electrical wiring member

Patent metadata

Field	Value
Publication number	US-2017307974-A1
Application number	US-201515523452-A
Country	US
Kind code	A1
Filing date	Oct 22, 2015
Priority date	Nov 5, 2014
Publication date	Oct 26, 2017
Grant date	—

Abstract

[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers ( 2 a and 2 b ); a step of forming a resist layer 4 a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.

First claim

1 . A method for producing an electrical device, the method comprising:
a step of forming, on at least one main surface of a substrate, a layered film in which a Cu layer and a CuNO blackening layer having an extinction coefficient of 1.0 or more and 1.8 or less in wavelengths of 400 nm to 700 nm are sequentially formed; a step of forming a resist layer in a predetermined region on the layered film; a step of removing a region of the layered film not covered with the resist layer, by bringing the layered film into contact with an etchant; and a step of forming, on the substrate and on the layered film having been patterned, a SiO 2 layer that is a dielectric layer having a refractive index different from a refractive index of the CuNO blackening layer, wherein the electrical device has a reflectivity of 5% or less.

2 - 15 . (canceled)

16 . An electrical device comprising:
a substrate; a patterned layered film in which, on at least one main surface of the substrate, a Cu layer and a CuNO blackening layer having an extinction coefficient of 1.0 or more and 1.8 or less in wavelengths of 400 nm to 700 nm are sequentially formed; and a SiO 2 layer that is a dielectric layer formed on the substrate and on the patterned layered film, and having a refractive index different from a refractive index of the CuNO blackening layer, wherein the electrical device has a reflectivity of 5% or less.

17 . The electrical device according to claim 16 , wherein a total thickness of the CuNO blackening layer and the SiO 2 layer is 100 nm or less.

Assignees

• Nissha Printing

Inventors

• Nada Hideaki
• Uefuji Hiroaki
• Shigeno Hirotaka
• Sakata Yoshihiro
• Matsui Yuki
• Takayama Hisaya

Classifications

• G06F2203/04107

  Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H05K9/0088

  comprising a plurality of shielding layers; combining different shielding material structure · CPC title

• G03F7/11

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

• H01B5/14

  comprising conductive layers or films on insulating-supports · CPC title