Polyetherimide varnish compositions, methods of manufacture, and articles prepared therefrom

Patent metadata

Field	Value
Publication number	US-2017306162-A1
Application number	US-201515518043-A
Country	US
Kind code	A1
Filing date	Oct 5, 2015
Priority date	Oct 10, 2014
Publication date	Oct 26, 2017
Grant date	—

Abstract

A varnish includes an isolated as-synthesized polyetherimide having a glass transition temperature of 180° C. or more, a solvent in an amount effective for the polyetherimide to remain in solution at a selected temperature, and an inorganic particulate composition wherein the amount of polyetherimide, inorganic particulate composition, and solvent total 100 wt %. Also disclosed is a method of manufacturing the varnish, articles prepared from the varnish, and methods of manufacturing such articles.

First claim

I/We claim:

1 . A varnish comprising
1 to 45 wt % of an isolated, as-synthesized polyetherimide having a glass transition temperature of 180° C. or more; a solvent in an amount effective for the polyetherimide to remain in solution at a selected temperature, 0 to 40 wt % of an inorganic particulate composition wherein the amount of polyetherimide, inorganic particulate composition, and solvent total 100 wt %; wherein the varnish has
a viscosity greater than 100 cP at 23° C., or
a viscosity greater than 30 cP at 90° C.

2 . The varnish of claim 1 , wherein the solvent is a polar, electron donating solvent optionally having a solubility parameter value of 8.5-13, a boiling point greater than 90° C., or both.

3 . The varnish of claim 1 , comprising 0.5 to 40 wt % the inorganic particulate composition, wherein the inorganic particulate composition comprises one or more of
a highly thermally conductive filler having a thermal conductivity of more than 45 W/mK; a thermally conductive filler having a thermal conductivity of 10 to 45 W/mK; a thermally insulating filler having a thermal conductivity of less than 10 W/mK; or a combination comprising at least one of the foregoing.

4 . The varnish of claim 1 , further comprising 30 to 90 wt %, based on the weight of the polyetherimide, of a thermosetting polymer composition, wherein a sample comprising the varnish, after removing the solvent and curing the thermosetting composition, has at least one of improved flame retardance, improved toughness, and improved peel strength from copper, compared to a sample of the cured thermosetting composition alone.

5 . The varnish of claim 1 wherein the varnish is disposed on a fibrous preform.

6 . A method of manufacturing the varnish of claim 1 , the method comprising
combining the components of the varnish; and heating the components at a temperature and for a period of time effective to dissolve the polyetherimide in the solvent.

7 . A method of manufacturing an article from the varnish of claim 1 , the method comprising
forming the article from the varnish; and removing the solvent from the formed article.

8 . The method of claim 7 , wherein the article is in the form of a fiber, a layer, a conformal coating, a cast article, a prepreg, or a cured composite article, and
the forming is by casting the varnish onto a substrate to form a cast layer; and the removing the solvent is by heating the cast layer, by heating the cast layer under heat and pressure, or by laminating the cast layer to another substrate.

9 . The method of claim 7 , wherein the article further comprises a fibrous preform, and forming the article comprises coating or impregnating the preform with the varnish.

10 . A method of preparing a copper clad laminate, the method comprising
laminating a polyetherimide layer prepared by the method of claim 8 to a conductive metal circuit layer under heat, pressure, or a combination thereof; and optionally, subsequently or simultaneously, laminating the polyetherimide layer to a supporting metal matrix layer, wherein the supporting metal matrix layer is disposed on the polyetherimide layer on a side opposite the conductive metal circuit layer.

11 . A method of preparing a metal core copper clad laminate, the method comprising
laminating a polyetherimide layer prepared by the method of claim 8 to a supporting metal matrix under heat, pressure, or a combination thereof; and subsequently or simultaneously, laminating the polyetherimide layer to a conductive metal circuit layer, wherein the conductive metal circuit layer is disposed on the polyetherimide dielectric layer on a side opposite the supporting metal matrix layer; wherein the laminate has a thermal conductivity of greater than 0.3 W/m-K.

12 . The method of claim 10 , wherein the polyetherimide layer further comprises a woven or nonwoven glass fabric and the polyetherimide layer is prepared by a method comprising
impregnating the glass fabric with the varnish of claim 1 ; and removing the solvent from the impregnated glass fabric.

13 . The method of claim 10 , wherein the polyetherimide layer further comprises a thermosetting polymer; and wherein after removing the solvent and fully curing the thermosetting polymer, the polyetherimide layer has at least one of improved flame retardance, improved toughness, and improved peel strength from copper, compared to the cured thermosetting polymer alone.

14 . The method of claim 13 , wherein
the thermosetting polymer is uncured or partially cured before the laminating; the thermosetting polymer is partially cured during the removing the solvent, after removing the solvent, or both; and the method further comprises fully curing the thermosetting polymer during the laminating or after the laminating or both.

15 . The method of claim 13 , wherein the thermosetting polymer is fully cured before the laminating.

16 . The method of claim 10 , further comprising
patterning the conductive metal circuit layer to provide a printed circuit board or a metal core printed circuit board; and optionally, shaping the printed circuit board or metal core printed circuit board to provide the shape of a sheet, tube, or rod.

17 . The method of claim 16 , wherein the metal core printed circuit board is used in a LED lighting application, a solar energy application, a television, a mobile phone, or a laptop computer, and provides heat dissipation.

18 . A method of manufacturing a composite, the method comprising
impregnating a porous base material with the varnish of claim 1 ; and removing the solvent from the impregnated porous base material; wherein the porous base material comprises a ceramic, a polymer, a glass, carbon, or a combination comprising at least one of the foregoing.

19 . An article comprising a composite formed by the method of claim 18 , wherein
the porous base material is a fibrous preform comprising woven or non-woven glass fabric, a fiberglass fabric, or a carbon fiber; the fibrous preform is coated or impregnated with the varnish; and the article is a prepreg, a sheet, a fiber, a wire coating, a molded article, or a compression article.

20 . A method of manufacturing a multilayer article, the method comprising
forming a layer comprising the varnish of claim 1 on a substrate; removing the solvent from the layer to provide a primer layer; forming a second layer comprising a ceramic, a thermoplastic polymer, a thermosetting polymer, or a combination comprising at least one of the foregoing on the primer layer to provide the multilayer article; and optionally thermally treating the multilayer article to cure the thermosetting polymer; wherein the second layer optionally further comprises the varnish of claim 1 , and forming the layer further comprises removing the solvent from the second layer; wherein
the ceramic is Al 2 O 3 , TiO 2 , ZrO 2 , Cr 2 O 3 , SiO 2 , MgO, BeO; Y 2 O 3 , Al 2 O 3 —SiO 2 , MgO—ZrO 2 , SiC, WC, B 4 C, TiC, Si 3 N 4 , TiN, BN, AlN, TiB, ZrB 2 , or a combination comprising at least one of the foregoing;
the thermoplastic polymer is a fluoropolymer, more preferably polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, polychlorotrifluoroethylene, tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride, or a combination comprising at least one of the foregoing; and
the thermosetting polymer composition is an epoxy, cyanate e

Assignees

• Sabic Global Technologies Bv

Inventors

• Yang Jian
• Shen Liang
• Zheng Liping
• Na Ying

Classifications

• C09D5/00

  Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title

• C09D4/00 Primary

  Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16} · CPC title

• D06M15/59

  Polyamides; Polyimides · CPC title

• C09D179/08 Primary

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title