This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 58548637 |
| Family type | — |
| Earliest priority | Apr 15, 2016 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2017303405A1 — Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device |
Best representative member for this family based on priority and filing country.
US2017303405A1 — Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device (published Oct 19, 2017)
Related publications in this family.