Retinal prosthesis and method of manufacturing a retinal prosthesis
US-9555244-B2 · Jan 31, 2017 · US
Package for an Implantable Neural Stimulation Device
US2017291028A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017291028-A1 |
| Application number | US-201715629196-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 21, 2017 |
| Priority date | Aug 18, 2006 |
| Publication date | Oct 12, 2017 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An implantable device having a biocompatible hermetic package made from a biocompatible electrically non-conductive substrate and a cover bonded to the substrate. In integrated circuit and passive circuits all bonded directly to the substrate.
First claim
Opening claim text (preview).
What we claim is: 1 . An implantable device, comprising: a biocompatible electrically non-conductive substrate; an integrated circuit attached directly to the substrate; passive circuits attached directly to the substrate; and a biocompatible cover bonded to the substrate, the cover and the substrate forming a hermetic package. 2 . The implantable device according to claim 1 , further comprising conductive traces deposited on the electrically non-conductive substrate. 3 . The implantable device according to claim 1 , further comprising a flexible circuit connected to the substrate and including electrodes suitable stimulate neural tissue. 4 . The implantable device according to claim 1 , further comprising a polymer body supporting the hermetic package and suitable to be attached to a sclera. 5 . The implantable device according to claim 4 , further comprising suture tabs on the polymer body suitable for attaching the polymer body to a sclera. 6 . The implantable device according to claim 1 , wherein the cover has convex in profile. 7 . The implantable device according to claim 1 , wherein the cover has concave in profile. 8 . The implantable device according to claim 1 , wherein the integrated circuit is a flip-chip circuit. 9 . The implantable device according to claim 2 , wherein the cover is brazed to the substrate. 10 . The implantable device according to claim 9 , further comprising a braze stop on the substrate and along a periphery of the substrate surrounding the conductive traces and separating a braze joint from the conductive traces. 11 . The implantable device according to claim 2 , wherein the conductive traces are metal traces. 12 . The implantable device according to claim 11 , wherein the metal traces are chosen to withstand braze temperatures. 13 . The implantable device according to claim 12 , wherein the metal traces comprise one or more of the metals titanium, tantalum, gold, palladium, platinum or layers or alloys thereof.
Assignees
Inventors
Classifications
comprising gold [Au] · CPC title
Constructional arrangements, e.g. casings · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title
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Frequently asked questions
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- What does patent US2017291028A1 cover?
- An implantable device having a biocompatible hermetic package made from a biocompatible electrically non-conductive substrate and a cover bonded to the substrate. In integrated circuit and passive circuits all bonded directly to the substrate.
- Who is the assignee on this patent?
- Second Sight Medical Products Inc
- What technology area does this patent fall under?
- Primary CPC classification A61N1/36046. Mapped technology areas include Human Necessities.
- When was this patent published?
- Publication date Thu Oct 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).