Thermal conductive adhesive and secondary battery containing the same

Patent metadata

Field	Value
Publication number	US-2017288278-A1
Application number	US-201615246717-A
Country	US
Kind code	A1
Filing date	Aug 25, 2016
Priority date	Mar 31, 2016
Publication date	Oct 5, 2017
Grant date	—

Abstract

The embodiment of the present application relates to the field of Li-ion battery and, in particular, to a thermal conductive adhesive and a secondary battery containing the thermal conductive adhesive. The thermal conductive adhesive is prepared through adding thermal conductive filling material in the hot melt adhesive system, which performs good thermal conductivity and adhering property, and can stably adhere the safety component with the cell, meanwhile transferring, via the thermal conductive adhesive, heat of the cell to the safety component rapidly, so that the safety component cuts off the circuit to protect the cell during overcharge; the thermal conductive adhesive has high initial viscosity, which increases good contact between the protection device and the cell through the adhesion, thereby reduces situations that the thermal conductive adhesive is separated from the cell due to inflation and deformation of the cell.

First claim

What is claimed is:

1 . A thermal conductive adhesive, comprising:
a hot melt adhesive and thermal conductive filling material.

2 . The thermal conductive adhesive according to claim 1 , wherein the hot melt adhesive is selected from at least one of EVA hot melt adhesive, polyamide hot melt adhesive, polyurethane hot melt adhesive, polyester hot melt adhesive, polyethylene hot melt adhesive, polyesteramide hot melt adhesive, styrene type thermoplastic elastomer; preferably, the polyurethane hot melt adhesive is selected from isocyanate polyurethane prepolymer; preferably, the styrene type thermoplastic elastomer is selected from styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer.

3 . The thermal conductive adhesive according to claim 1 , wherein the thermal conductive filling material is selected from at least one of metal, metallic oxide, carbon material, nitride, carbide, silicon material; the metal is preferably selected from at least one of silver, copper or tin; the metallic oxide is preferably selected from at least one of aluminium oxide, magnesium oxide, zinc oxide, titanium oxide, SnO y ; the carbon material is preferably selected from at least one of hard carbon, soft carbon, mesocarbon microbead, carbon nano tube, graphite, graphene; the nitride is preferably selected from at least one of silicon nitride, aluminium nitride, boron nitride, titanium nitride; the carbide is preferably selected from at least one of silicon carbide, tungsten carbide; the silicon material is preferably selected from at least one of Si, SiO x ; wherein, 0<x<=2, 0<y<=2.

4 . The thermal conductive adhesive according to claim 1 , wherein thermal conductive coefficient of the thermal conductive filling material is 1 W/mK˜10000 W/mK, preferably 20 W/mK˜6000 W/mK.

5 . The thermal conductive adhesive according to claim 1 , wherein particle size of the thermal conductive filling material is 1 nm˜100 μm, or, the thermal conductive filling material contains thermal conductive filling material particle with particle size larger than 1 nm but smaller than 1 μm, and thermal conductive filling material particle with particle size larger than 1 μm but smaller than 50 μm.

6 . The thermal conductive adhesive according to claim 1 , wherein the thermal conductive filling material occupies 1%˜99% weight of the thermal conductive adhesive, preferably 20%˜75%.

7 . The thermal conductive adhesive according to claim 1 , wherein melt viscosity of the thermal conductive adhesive is 1000˜1*10 6 CPs, initial viscosity is 0.5˜100N, peeling strength is 0.1˜20N/3 mm, melting temperature is 120° C.˜190° C., thermal conductive coefficient is 0.1˜10000 W/mK; preferably, the melt viscosity of the thermal conductive adhesive is 1000˜20000 CPs, the initial viscosity is 0.5˜60N, the peeling strength is 0.5˜10N/3 mm, the melting temperature is 160° C.˜180° C., the thermal conductive coefficient is 0.1˜100 W/mK.

8 . An application of the thermal conductive adhesive according to claim 1 in a secondary battery.

9 . A secondary battery, comprising a cell, a safety component fixed on the cell and thermal conductive adhesive provided between the cell and the safety component, characterized in that, the thermal conductive adhesive is the thermal conductive adhesive according to claim 1 , preferably, area of the thermal conductive adhesive is 1 mm 2 ˜500 mm 2 , thickness of the thermal conductive adhesive is 0.01˜10 mm.

10 . A method for preparing the secondary battery according to claim 9 , wherein comprising: adding the thermal conductive adhesive on the safety component or the cell, applying a force of 0.1˜100N so that the safety component is tightly adhered with the cell.

Assignees

• Dongguan Amperex Tech Ltd

Inventors

• Ming Bangsheng
• Gao Wei
• Zhao Deqiang
• Jia Shiqiang
• Zhao Fenggang
• Geng Jibin

Classifications

• H01M2200/106

  PTC · CPC title

• H01M2200/103

  Fuse · CPC title

• H01M2200/10

  Temperature sensitive devices · CPC title

• H01M10/052

  Li-accumulators · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title