Additive for high-purity copper electrolytic refining and method of producing high-purity copper

Patent metadata

Field	Value
Publication number	US-2017283966-A1
Application number	US-201515509495-A
Country	US
Kind code	A1
Filing date	Oct 2, 2015
Priority date	Oct 4, 2014
Publication date	Oct 5, 2017
Grant date	—

Abstract

The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, in which a dispersion term dD of the Hansen solubility parameters satisfies 10≦dD≦20, a polarity term dP of the Hansen solubility parameters satisfies 6≦dP≦9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9≦dH≦11.

First claim

1 . An additive for high-purity copper electrolytic refining which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, wherein
a dispersion term dD of Hansen solubility parameters satisfies 10≦dD≦20, a polarity term dP of the Hansen solubility parameters satisfies 6≦dP≦9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9≦dH≦11.

2 . The additive for high-purity copper electrolytic refining according to claim 1 , wherein
the dispersion term dD of the Hansen solubility parameters of the additive satisfies 12≦dD≦17, the polarity term dP thereof satisfies 7dP≦9, and the hydrogen bonding term dH thereof satisfies 9≦dH≦11.

3 . A method of producing high-purity copper comprising:
performing electrolysis using a copper electrolyte to which an additive is added which is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group and in which a dispersion term dD of the Hansen solubility parameters satisfies 10≦dD≦20, a polarity term dP of the Hansen solubility parameters satisfies 6≦dP≦9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9≦dH≦11.

4 . The method of producing high-purity copper according to claim 3 , wherein
a concentration of the additive in the copper electrolyte is in a range of 2 to 500 mg/L.

5 . The method of producing high-purity copper according to claim 3 , wherein
the copper electrolyte is one of the group consisting of a copper sulfate solution, a copper nitrate solution, and a copper chloride solution.

6 . The method of producing high-purity copper according to claim 5 , wherein
the copper electrolyte has a copper concentration of 5 to 90 g/L and is one of the group consisting of a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L, a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L, and a copper chloride solution having a hydrochloric acid concentration of 10 to 300 g/L.

7 . The method of producing high-purity copper according to claim 3 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

8 . The method of producing high-purity copper according to claim 4 , wherein
the copper electrolyte is one of the group consisting of a copper sulfate solution, a copper nitrate solution, and a copper chloride solution.

9 . The method of producing high-purity copper according to claim 8 , wherein
the copper electrolyte has a copper concentration of 5 to 90 g/L and is one of the group consisting of a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L, a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L, and a copper chloride solution having a hydrochloric acid concentration of 10 to 300 g/L.

10 . The method of producing high-purity copper according to claim 4 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

11 . The method of producing high-purity copper according to claim 5 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

12 . The method of producing high-purity copper according to claim 6 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

13 . The method of producing high-purity copper according to claim 8 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

14 . The method of producing high-purity copper according to claim 9 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Tarutani Yoshie
• Kubota Kenji
• Nakaya Kiyotaka

Classifications

• C08L71/02

  Polyalkylene oxides · CPC title

• C25C1/12 Primary

  of copper · CPC title

• C08G65/329

  with organic compounds · CPC title