Additive for high-purity copper electrolytic refining and method of producing high-purity copper
US-10358730-B2 · Jul 23, 2019 · US
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Patent family 55949714
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55949714 |
| Family type | — |
| Earliest priority | Oct 4, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10358730B2 — Additive for high-purity copper electrolytic refining and method of producing high-purity copper |
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US10358730B2 — Additive for high-purity copper electrolytic refining and method of producing high-purity copper (published Jul 23, 2019)
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