Electroconductive particle, circuit connecting material, mounting body, and method for manufacturing mounting body
US-2015047878-A1 · Feb 19, 2015 · US
US2017333989A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017333989-A1 |
| Application number | US-201515520855-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 29, 2015 |
| Priority date | Oct 24, 2014 |
| Publication date | Nov 23, 2017 |
| Grant date | — |
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A conductive particle including a conductive powder, a conductive polymer composition, and an anisotropic conductive sheet, each of which has a particularly smaller volume resistivity and better conductivity than those of the related art, and is desirably inexpensive. A conductive particle includes a first plating layer (pure Ni plating layer or Ni plating layer containing 4.0 mass % or less of P) covering the surface of a spherical Ni core containing 5 mass % to 15 mass % or less of P. The conductive particle may further include a Au plating layer having a thickness of from 5 nm to 200 nm and covering the surface of the first plating layer.
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1 . A conductive particle, comprising: a spherical Ni core containing 5 mass % or more and 15 mass % or less of P; and a first plating layer covering a surface of the Ni core, wherein the first plating layer comprises a pure Ni plating layer or a Ni plating layer containing 4.0 mass % or less of P. 2 . The conductive particle according to claim 1 , wherein the first plating layer has a thickness of 0.1 μm or more and 10 μm or less. 3 . The conductive particle according to claim 1 , wherein the Ni core has a diameter of 1 μm or more and 100 μm or less. 4 . The conductive particle according to claim 1 , further comprising a second plating layer covering a surface of the first plating layer, wherein the second plating layer comprises a Au plating layer having a thickness of 5 nm or more and 200 nm or less. 5 . A conductive powder, comprising the conductive particles of claim 1 , the conductive powder having a median diameter d50 in a cumulative volume distribution curve of 3 μm or more and 100 μm or less, and satisfying [(d90−d10)/d50]≦0.8. 6 . A conductive polymer composition, comprising: the conductive powder of claim 5 ; and a polymer, wherein the polymer comprises a rubber, a thermoplastic resin, a thermosetting resin, or a photocurable resin. 7 . An anisotropic conductive sheet, comprising the conductive polymer composition of claim 6 , wherein the conductive particles are arranged in a thickness direction of the anisotropic conductive sheet.
Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title
Metallic particles coated with metal · CPC title
the conductive material comprising metals or alloys · CPC title
comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24) · CPC title
based on nickel · CPC title
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