Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same

Patent metadata

Field	Value
Publication number	US-2017274453-A1
Application number	US-201515504109-A
Country	US
Kind code	A1
Filing date	Mar 26, 2015
Priority date	Aug 26, 2014
Publication date	Sep 28, 2017
Grant date	—

Abstract

Provided is a dendritic silver-coated copper powder which is capable of effectively ensuring a contact, while having excellent electrical conductivity by having the surface coated with silver. A silver-coated copper powder according to the present invention is obtained by coating the surface of a copper powder 1 , which is an assembly of copper particles 2 and has a dendritic form having a plurality of branches, with silver. Each copper particle 2 , the surface of which is coated with silver, is an ellipsoid that has a breadth within the range of from 0.2 μm to 0.5 μm and a length within the range of from 0.5 μm to 2.0 μm. The average particle diameter (D50) of the copper powder 1 , which is obtained by coating the surface of the assembly of the ellipsoidal copper particles 2 with silver, is from 5.0 μm to 20 μm.

First claim

1 . A silver-coated copper powder, wherein
a surface of a copper powder formed of copper particles gathered to constitute a dendritic shape having a plurality of branches is coated with silver, the copper particles having the surface coated with silver are an ellipsoid having a size in a range of from 0.2 μm to 0.5 μm as a minor axis diameter and from 0.5 μm to 2.0 μm as a major axis diameter, and an average particle diameter (D50) of the copper powder that is constituted as ellipsoidal copper particles gather and has the surface coated with silver is from 5.0 μm to 20 μm.

2 . The silver-coated copper powder according to claim 1 , wherein a diameter of a dendritic branch portion is from 0.5 μm to 2.0 μm in the copper powder having the surface coated with silver.

3 . The silver-coated copper powder according to claim 1 , wherein an amount of silver coated is from 1% by mass to 50% by mass with respect to 100% by mass of the entire silver-coated copper powder coated with silver.

4 . The silver-coated copper powder according to claim 1 , wherein a BET specific surface area value is from 0.3 m 2 /g to 3.0 m 2 /g.

5 . A metal filler comprising the silver-coated copper powder according to claim 1 at a proportion of 20% by mass or more to the entire metal filler.

6 . The metal filler according to claim 5 , comprising a spherical copper powder having an average particle diameter (D50) of from 0.5 μm to 10 μm.

7 . The metal filler according to claim 6 , wherein
the spherical copper powder is a spherical silver-coated copper powder having a surface coated with silver, and an amount of silver coated on the spherical silver-coated copper powder is from 1% by mass to 50% by mass with respect to 100% by mass of the entire spherical silver-coated copper powder coated with silver.

8 . An electrically conductive paste comprising the metal filler according to claim 5 , a binder resin, and a solvent.

9 . An electrically conductive coating material for electromagnetic wave shielding comprising the metal filler according to claim 5 .

10 . An electrically conductive sheet for electromagnetic wave shielding comprising the metal filler according to claim 5 .

Assignees

• Sumitomo Metal Mining Co

Inventors

• Okada Hiroshi
• Yamashita Hideyuki

Classifications

• B22F1/06

  Metallic powder characterised by the shape of the particles (nanosized particles B22F1/054) · CPC title

• B22F1/00

  Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title

• B22F1/17

  Metallic particles coated with metal · CPC title

• B22F1/05

  Metallic powder characterised by the size or surface area of the particles · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title