Inductor module and electric power transmission system
US-2018019053-A1 · Jan 18, 2018 · US
Sensor device and semiconductor device
US2017254861A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017254861-A1 |
| Application number | US-201715443134-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 27, 2017 |
| Priority date | Mar 1, 2016 |
| Publication date | Sep 7, 2017 |
| Grant date | — |
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- Title
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Abstract
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A sensor device is provided including: an electric wire; a semiconductor device including an inductor and an amplifier, the inductor being configured to detect a magnetic field generated around the electric wire, the amplifier including a bipolar element configured to amplify a voltage generated at the inductor; and a substrate on which the first semiconductor device and the electric wire are arranged such that the first semiconductor device is apart from the electric wire by at least a given distance. In a plan view of the substrate, the electric wire does not overlap the first semiconductor device.
First claim
Opening claim text (preview).
What is claimed is: 1 . A sensor device comprising: an electric wire; a first semiconductor device including an inductor and an amplifier, the inductor being configured to detect a magnetic field generated around the electric wire, the amplifier including a bipolar element configured to amplify a voltage generated at the inductor; and a substrate on which the first semiconductor device and the electric wire are arranged such that the first semiconductor device is apart from the electric wire by at least a given distance, wherein in a plan view of the substrate, the electric wire does not overlap the first semiconductor device. 2 . The sensor device according to claim 1 , further comprising a second semiconductor device, wherein the first semiconductor device and the second semiconductor device are arranged on the substrate to be respectively apart from the electric wire by at least the given distance, and wherein in the plan view of the substrate, the electric wire is disposed between the first semiconductor device and the second semiconductor device without contacting either the first semiconductor device or the second semiconductor device. 3 . The sensor device according to claim 1 , wherein the first semiconductor device includes a base current correction circuit configured to generate a correction current for flowing in an opposite direction to a direction of a base current of a bipolar transistor included in the amplifier, and to reduce an electric current that flows in the inductor. 4 . A sensor device comprising: an electric wire; a semiconductor device including an inductor and an amplifier, the inductor being configured to detect a magnetic field generated around the electric wire, the amplifier including a bipolar element configured to amplify a voltage generated at the inductor; and a substrate on which the semiconductor device and the electric wire are arranged such that the semiconductor device is apart from the electric wire by at least a given distance, wherein the substrate has a first surface and a second surface opposite to the first surface, wherein the electric wire is arranged on the first surface, and wherein the semiconductor device is arranged on the second surface. 5 . The sensor device according to claim 4 , wherein the semiconductor device includes a base current correction circuit configured to generate a correction current for flowing in an opposite direction to a direction of a base current of a bipolar transistor included in the amplifier, and to reduce an electric current that flows in the inductor. 6 . A semiconductor device comprising: an inductor configured to detect a magnetic field generated around an electric wire; and an amplifier including a bipolar element configured to amplify a voltage generated at the inductor, wherein the semiconductor device is used in a sensor device configured to detect a density of magnetic flux generated by an electric current that flows in the electric wire, and wherein the semiconductor device is arranged to be apart from the electric wire by at least a given distance.
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Classifications
Package configurations · CPC title
comprising organic materials, e.g. plastics or resins · CPC title
Inductive arrangements or effects of, or between, wiring layers · CPC title
the amplifier being a low noise amplifier [LNA] · CPC title
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2017254861A1 cover?
- A sensor device is provided including: an electric wire; a semiconductor device including an inductor and an amplifier, the inductor being configured to detect a magnetic field generated around the electric wire, the amplifier including a bipolar element configured to amplify a voltage generated at the inductor; and a substrate on which the first semiconductor device and the electric wire are a…
- Who is the assignee on this patent?
- Ohara Tomomitsu, Aikyo Yasuaki, Sakurada Tomoyuki, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G01R33/0023. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Sep 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).