Semiconductor device
US-2024282677-A1 · Aug 22, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/293 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,917 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 150 |
| 2016 | 210 |
| 2017 | 252 |
| 2018 | 203 |
| 2019 | 203 |
| 2020 | 181 |
| 2021 | 138 |
| 2022 | 120 |
| 2023 | 135 |
| 2024 | 138 |
| 2025 | 158 |
| 2026 | 29 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Surface Treatment Compositions and Methods
US-2024258111-A1 · Aug 1, 2024 · US
High current power module package with linear operation capabilities and sensing capabilities
US-2024170482-A1 · May 23, 2024 · US
Semiconductor device
US-2015380331-A1 · Dec 31, 2015 · US
Underfill sheet, underfill sheet integrated with tape for grinding rear surface, underfill sheet integrated with dicing tape, and method for manufacturing semiconductor device
US-2015380277-A1 · Dec 31, 2015 · US
Semiconductor device and semiconductor package
US-2015371983-A1 · Dec 24, 2015 · US
Silicon shield for package stress sensitive devices
US-2015364431-A1 · Dec 17, 2015 · US
Methods of Packaging Semiconductor Devices and Structures Thereof
US-2015364395-A1 · Dec 17, 2015 · US
Producing method of encapsulating layer-covered semiconductor element and producing method of semiconductor device
US-9214362-B2 · Dec 15, 2015 · US
Power semiconductor device and preparation method thereof
US-9214419-B2 · Dec 15, 2015 · US
Modifier for resin and resin composition using the same and formed article
US-9206310-B2 · Dec 8, 2015 · US
Encapsulating composition, barrier layer including same, and encapsulated apparatus including same
US-2015344697-A1 · Dec 3, 2015 · US
Semiconductor package having heat dissipating member
US-2015348863-A1 · Dec 3, 2015 · US
Semiconductor structure and manufacturing method thereof
US-2015348927-A1 · Dec 3, 2015 · US
Over-mold plastic packaged wide band-gap power transistors and mmics
US-2015348886-A1 · Dec 3, 2015 · US
Curable epoxy resin composition
US-9200133-B2 · Dec 1, 2015 · US
Underfill composition and semiconductor device and manufacturing method thereof
US-2015332984-A1 · Nov 19, 2015 · US
Semiconductor package
US-2015325492-A1 · Nov 12, 2015 · US
Semiconductor package
US-9184107-B2 · Nov 10, 2015 · US
Inkjet printing in a peripheral region of a substrate
US-9177790-B2 · Nov 3, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/293?
- CPC H01L23/293 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/293 (Electricity)?
- Our database includes 1,917 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/293 growing?
- Publication counts under this code: 138 in 2024 vs 158 in 2025 (latest complete years).