Hot melt adhesive composition including a block composite compatibilizer

Patent metadata

Field	Value
Publication number	US-2017240784-A1
Application number	US-201515505493-A
Country	US
Kind code	A1
Filing date	Aug 20, 2015
Priority date	Aug 21, 2014
Publication date	Aug 24, 2017
Grant date	—

Abstract

A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.

First claim

What is claimed is:

1 . A hot melt adhesive composition, comprising:
(A) 1-60 wt % of a block composite compatibilizer comprising:
(i) a hard polymer that includes propylene;
(ii) a soft polymer that includes ethylene; and
(iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer;
(B) 1-70 wt % of a tackifier; (C) 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.

2 . The hot melt adhesive composition as claimed in claim 1 , wherein the composition includes the ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP).

3 . The hot melt adhesive composition as claimed in claim 1 , wherein the composition includes the propylene-based polymer having a density from 0.85 g/cc to 0.90 g/cc and a Brookfield viscosity of less than 50,000 cP.

4 . The hot melt adhesive composition as claimed in claim 1 , wherein:
the composition includes the ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP); and the composition includes the propylene-based polymer having a density from 0.85 g/cc to 0.90 g/cc and a Brookfield viscosity of less than 50,000 cP.

5 . The hot melt adhesive composition as claimed in claim 1 , wherein the composition excludes the propylene-based polymer and includes the ethylene-based polymer having a density from 0.86 g/cc to 0.885 g/cc, a melt index (I 2 ) from 5 g/10 min to 3,000 g/10 min, and a Brookfield viscosity of less than 50,000 centipoise (cP).

6 . The hot melt adhesive composition as claimed in claim 1 , wherein the soft block of the block copolymer includes from 50 wt % to 84 wt % of units derived from ethylene with a remainder derived from propylene.

7 . The hot melt adhesive composition as claimed in claim 6 , wherein the hard block of the block copolymer includes from 0 wt % to 20 wt % of units derived from ethylene and a remainder derived from propylene.

8 . The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a microstructure index of greater than 1 to less than 20.

9 . The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a block composite index of greater than 0 and less than 1.0.

10 . The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a modified block composite index of greater than 0 and less than 1.0.

11 . The hot melt adhesive composition as claimed in claim 1 , further comprising from 1-5 wt % of an antioxidant.

12 . The hot melt adhesive composition as claimed in claim 1 , wherein the block composite compatibilizer has a melt index (I 2 ) from 300 g/10 min to 700 g/10 min.

13 . The hot melt adhesive composition as claimed in claim 1 , further comprising a propylene based polymer and an ethylene based wax.

14 . The hot melt adhesive composition as claimed in claim 1 , wherein the composition has a peel adhesion failure temperature of from 50° C. to 70° C.

15 . The holt melt adhesive composition as claimed in claim 1 , wherein the composition has a fiber tear greater than 60% at a temperature of from −40° C. to 60° C.

16 . The hot melt adhesive composition as claimed in claim 1 , wherein the composition has a set time of less than or equal to 3 seconds.

17 . An article comprising:
a substrate; and a hot melt adhesive composition as claimed in claim 1 on at least one surface of the substrate.

Assignees

• Dow Global Technologies Llc

Inventors

• Jin Yi
• Walton Kim L
• Marchand Gary R
• Yalvac Salim
• Mclennaghan Allan Walter
• Conley Burcak
• Lee Dean
• Cong Rongjuan
• Li Pi Shan Colin

Classifications

• C09J7/35

  Heat-activated · CPC title

• C08L23/142

  at least partially crystalline copolymers of propene with other olefins · CPC title

• C09J123/142

  at least partially crystalline copolymers of propene with other olefins · CPC title

• C08L91/06

  Waxes · CPC title

• C09J123/10

  Homopolymers or copolymers of propene · CPC title