Conductor strip with contact areas having cutouts
US-9406592-B2 · Aug 2, 2016 · US
Electrode terminal, semiconductor device, and power conversion apparatus
US2017221853A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017221853-A1 |
| Application number | US-201615286771-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 6, 2016 |
| Priority date | Feb 3, 2016 |
| Publication date | Aug 3, 2017 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electrode terminal comprising: a body including a first metal material; and a first bonding part which is bonded to one end of said body and includes a second metal material which is a clad material other than said first metal material, wherein said first bonding part is ultrasonically bondable to a first bonded member, and an elastic part which is elastically deformable is provided between said one end of said body and the other end of said body. 2 . The electrode terminal according to claim 1 , wherein said elastic part includes a bent part or a notched part. 3 . The electrode terminal according to claim 1 , wherein a surface of said body is provided with a hole or irregularities. 4 . The electrode terminal according to claim 1 , wherein said other end of said body is ultrasonically bondable to a second bonded member. 5 . The electrode terminal according to claim 4 , wherein said first bonding part or said other end of said body is bondable by solder or a screw, instead of being ultrasonically bondable. 6 . The electrode terminal according to claim 1 , further comprising a second bonding part which is bonded to said other end of said body and includes a third metal material which is a clad material other than said first metal material, wherein said second bonding part is ultrasonically bondable to a second bonded member. 7 . The electrode terminal according to claim 1 , wherein said first bonding part protrudes from said one end of said body in plan view. 8 . The electrode terminal according to claim 1 , wherein a surface which is ultrasonically bonded to said first bonded member in said first bonding part is provided with a groove or irregularities. 9 . A semiconductor device comprising: the electrode terminal according to claim 1 ; and said first bonded member, wherein said first bonded member includes a semiconductor chip or a circuit pattern, and is ultrasonically bonded to said first bonding part. 10 . The semiconductor device according to claim 9 , further comprising a case which surrounds a side part of said first bonded member, wherein said body of said electrode terminal is integrated with said case. 11 . The semiconductor device according to claim 9 , wherein said first bonded member is said semiconductor chip, and said semiconductor device further comprises a control circuit part which is electrically connected to said semiconductor chip. 12 . The semiconductor device according to claim 11 , wherein said semiconductor chip includes a wide band-gap semiconductor. 13 . A power conversion apparatus comprising the semiconductor device according to claim 9 .
Assignees
Inventors
Classifications
changes in shapes · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
Die-attach connectors and strap connectors · CPC title
Bond wires and strap connectors · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
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Frequently asked questions
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- What does patent US2017221853A1 cover?
- An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is pr…
- Who is the assignee on this patent?
- Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W72/0116. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).