Circuit Board and Smart Card Module and Smart Card Utilizing the Same

Patent metadata

Field	Value
Publication number	US-2017221807-A1
Application number	US-201715422795-A
Country	US
Kind code	A1
Filing date	Feb 2, 2017
Priority date	Feb 2, 2016
Publication date	Aug 3, 2017
Grant date	—

Abstract

A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component. The pad region comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the traces comprises an extension which extends along a perimeter of the pad region. The present invention provides a reliable adhesion between the chip and pad region.

First claim

1 . A circuit board comprising:
a substrate; and a pad region provided on the substrate, the pad region configured for mounting an electronic component, the pad region comprising a plurality of pads spaced from each other and traces connected to their respective pads, wherein at least one of the traces comprises an extension which extends along a perimeter of the pad region.

2 . The circuit board of claim 1 , wherein the extension extends from a portion of the associated trace adjacent the pad toward one adjacent trace along a perimeter of the pad region.

3 . The circuit board of claim 1 , wherein the circuit board is a flexible printed circuit board, and the electronic component mounted on the pad region is a chip.

4 . The circuit board of claim 1 , wherein there are a plurality of the extensions, and the extensions cooperatively define a preset shape along the perimeter of the pad region.

5 . The circuit board of claim 1 , wherein a thickness of the extension is in the range of 10 um to 15 um.

6 . The circuit board of claim 1 , wherein a thickness of the extension is 10 um.

7 . The circuit board of claim 1 , wherein the circuit board further comprises a group of positioning marks, and each of the positioning marks is formed at a position away from the pad region.

8 . The circuit board of claim 7 , wherein the group of positioning marks include four positioning marks.

9 . The circuit board of claim 1 , wherein each of the pads on the pad region is a round pad.

10 . The circuit board of claim 1 , wherein a distance between centers of two adjacent pads is greater than or equal to 142 um.

11 . The circuit board of claim 10 , wherein the distance is 177 um.

12 . The circuit board of claim 1 , wherein portions of all traces within the pad region have the same width.

13 . The circuit board of claim 1 , wherein a distance between two adjacent pads is greater than or equal to 40 um.

14 . The circuit board of claim 13 , wherein the distance is 75 um.

15 . The circuit board of claim 1 , wherein at least one of the traces is formed with a via hole passing through the substrate, and the via hole is filled with a conducting medium.

16 . A smart card module comprising:
a chip; and a circuit board comprising:
a substrate; and
a pad region provided on the substrate, the pad region configured for mounting an electronic component, the pad region comprising a plurality of pads spaced from each other and traces connected to their respective pads, wherein at least one of the traces comprises an extension which extends along a perimeter of the pad region.

17 . The smart card module of claim 16 , wherein the chip is assembled as a flip-chip.

18 . A smart card comprising:
a card body defining a groove; and a smart card module disposed in the groove of the card body, the smart card module comprising:
a chip; and
a circuit board comprising:
a substrate; and
a pad region provided on the substrate, the pad region configured for mounting an electronic component, the pad region comprising a plurality of pads spaced from each other and traces connected to their respective pads, wherein at least one of the traces comprises an extension which extends along a perimeter of the pad region.

19 . The smart card of claim 18 , wherein the chip is assembled as a flip-chip.

Assignees

• Johnson Electric Sa

Inventors

• Ward Dominic John
• Zhang Rong
• Zhang yi qi

Classifications

• G06K19/07722 Primary

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

• G06K19/07745

  Mounting details of integrated circuit chips · CPC title

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/101

  characterised by the type of information, e.g. logos or symbols · CPC title