Method for Producing a Printed Circuit, Printed Circuit Obtained by This Method and Electronic Module Comprising Such a Printed Circuit
US-2016105961-A1 · Apr 14, 2016 · US
Circuit Board and Smart Card Module and Smart Card Utilizing the Same
US2017221806A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017221806-A1 |
| Application number | US-201715422758-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 2, 2017 |
| Priority date | Feb 2, 2016 |
| Publication date | Aug 3, 2017 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component, and comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the pads has an arc edge. In the present invention, the distance between the pads is easy to be controlled during fabrication, and the stability of the adhesion between the chip and pad region is enhanced.
First claim
Opening claim text (preview).
1 . A circuit board comprising: a substrate; and a pad region provided on the substrate, the pad region configured for mounting an electronic component, the pad region comprising a plurality of pads spaced from each other and traces connected to their respective pads, wherein at least one of the pads has an arc edge. 2 . The circuit board of claim 1 , wherein the pads are round pads or elliptical pads. 3 . The circuit board of claim 1 , wherein the circuit board is a flexible printed circuit board, and the electronic component mounted on the pad region is a chip. 4 . The circuit board of claim 1 , wherein at least one of the traces comprises an extension which extends along a perimeter of the pad region, there are a plurality of the extensions, and the extensions cooperatively define a preset shape along the perimeter of the pad region. 5 . The circuit board of claim 1 , wherein a thickness of the extension is in the range of 10 um to 15 um. 6 . The circuit board of claim 1 , wherein a thickness of the extension is 10 um. 7 . The circuit board of claim 1 , wherein the circuit board further comprises a group of positioning marks, and each of the positioning marks is formed at a position away from the pad region. 8 . The circuit board of claim 7 , wherein the group of positioning marks include four positioning marks. 9 . The circuit board of claim 1 , wherein a distance between centers of two adjacent pads is greater than or equal to 142 um. 10 . The circuit board of claim 1 , wherein portions of all traces within the pad region have the same width. 11 . The circuit board of claim 1 , wherein a distance between two adjacent pads is greater than or equal to 40 um. 12 . The circuit board of claim 1 , wherein at least one of the traces is formed with a via hole passing through the substrate, and the via hole is filled with a conducting medium. 13 . A smart card module comprising: a chip; and a circuit board comprising: a substrate; and a pad region provided on the substrate, the pad region configured for mounting an electronic component, the pad region comprising a plurality of pads spaced from each other and traces connected to their respective pads, wherein at least one of the pads has an arc edge. 14 . The smart card module of claim 13 , wherein the pads are round pads or elliptical pads. 15 . A smart card comprising: a card body defining a groove; and a smart card module disposed in the groove of the card body, the smart card module comprising: a chip; and a circuit board comprising: a substrate; and a pad region provided on the substrate, the pad region configured for mounting an electronic component, the pad region comprising a plurality of pads spaced from each other and traces connected to their respective pads, wherein at least one of the pads has an arc edge. 16 . The smart card of claim 15 , wherein the pads are round pads or elliptical pads.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
on active surfaces of flip-chip devices, e.g. underfills · CPC title
Active alignment, e.g. using optical alignment using marks or sensors · CPC title
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Frequently asked questions
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- What does patent US2017221806A1 cover?
- A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component, and comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the pads has an arc edge. In…
- Who is the assignee on this patent?
- Johnson Electric Sa
- What technology area does this patent fall under?
- Primary CPC classification H10W70/65. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).