Method for Producing a Printed Circuit, Printed Circuit Obtained by This Method and Electronic Module Comprising Such a Printed Circuit

Patent metadata

Field	Value
Publication number	US-2016105961-A1
Application number	US-201414894558-A
Country	US
Kind code	A1
Filing date	May 27, 2014
Priority date	May 30, 2013
Publication date	Apr 14, 2016
Grant date	—

Abstract

The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.

First claim

1 . A method for fabricating a printed circuit for smart card electronic module comprising
the production of a composite comprising a first and a second layers of electrically conductive material, attached to an insulating substrate and furthermore comprising at least one bonding hole extending in the insulating substrate between a bottom at least partially closed by the first layer of conductive material and an opening into one side of the insulating substrate, and the production by photolithography and etching of patterns on the second layer of electrically conductive material, characterized by the fact that it furthermore comprises an operation of protecting the bonding hole with a soluble material during a step distinct from the production of patterns on the second layer of electrically conductive material and by the fact that the production of patterns on the second layer of electrically conductive material leaves an area of at least ten microns around the bonding hole devoid of the electrically conductive material of the second layer of electrically conductive material.

2 . The method as claimed in claim 1 , in which the operation of protecting the bonding hole is carried out after the production of patterns on the second layer of electrically conductive material.

3 . The method as claimed in claim 1 , in which the bonding hole is produced by perforation of the insulating substrate after the production of patterns on the second layer of electrically conductive material.

4 . The method as claimed in claim 1 , in which the bonding hole is produced by perforation of the insulating substrate before the production of patterns on the second layer of electrically conductive material.

5 . The method as claimed in claim 3 , in which the first layer of electrically conductive material is laminated on the insulating substrate after the production of the bonding hole by perforation of the insulating substrate.

6 . The method as claimed in claim 5 , in which patterns are produced by photolithography on the first layer of electrically conductive material after lamination of the first layer of electrically conductive material on the insulating substrate and therefore after perforation of the bonding hole.

7 . The method as claimed in claim 1 , in which the operation of protecting the bonding hole is carried out before the production of patterns on the second layer of electrically conductive material.

8 . The method as claimed in claim 1 , in which patterns are produced in the course of the same steps on the first and the second layers of electrically conductive material.

9 . The method as claimed in claim 1 , in which the soluble material is a resin.

10 . The method as claimed in claim 9 , in which a micro-development step precedes the production of the patterns on the first and the second layers of electrically conductive material.

11 . A printed circuit for an electronic module of a smart card including a composite with
a first and a second layers of electrically conductive material, attached to an insulating substrate, at least one bonding hole extending in the insulating substrate between a bottom at least partially closed by the first layer of conductive material and an opening into one side of the insulating substrate, and etched patterns in the second layer of electrically conductive material, characterized by the fact that it includes an area of at least ten microns around the bonding hole devoid of the electrically conductive material of the second layer of electrically conductive material.

12 . An electronic module for a smart card, comprising a flexible printed circuit including a composite with
a first and second layers of electrically conductive material, attached to an insulating substrate, at least one bonding hole extending in the insulating substrate between a bottom at least partially closed by the first layer of conductive material and an opening into one side of the insulating substrate, and etched patterns in the second layer of electrically conductive material, characterized by the fact that it includes an area of at least ten microns around the bonding hole devoid of the electrically conductive material of the second layer of electrically conductive material.

Assignees

• Linxens Holding

Inventors

• Dieu-Gomont Severine
• Hoveman Bertrand

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/07504

  the auxiliary member being temporary, e.g. a sacrificial coating · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W72/075

  of bond wires · CPC title