Copper Foil, Copper-Clad Laminate Board, Method for Producing Printed Wiring Board, Method for Producing Electronic Apparatus, Method for Producing Transmission Channel, and Method for Producing Antenna

Patent metadata

Field	Value
Publication number	US-2017208686-A1
Application number	US-201715405517-A
Country	US
Kind code	A1
Filing date	Jan 13, 2017
Priority date	Jan 15, 2016
Publication date	Jul 20, 2017
Grant date	—

Abstract

To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having adhered thereto an insulating substrate.

First claim

1 . A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil.

2 . The copper foil according to claim 1 , wherein the copper foil satisfies at least one of the following conditions (2-1) to (2-2):
(2-1) the copper foil has a number of cracks having a depth of 1 μm or more from a surface of the copper foil being 3 or less after a sliding bending test in a prescribed number of times under a prescribed condition for a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil, in an observation of a region having a size of a thickness of the copper foil×100 μm on a cross section of the copper foil in parallel to a sliding direction in the sliding bending test; (2-2) the copper foil has a number of cracks having a depth of 2 μm or more from a surface of the copper foil being 2 or less after a sliding bending test in a prescribed number of times under a prescribed condition for a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil, in an observation of a region having a size of a thickness of the copper foil×100 μm on a cross section of the copper foil in parallel to a sliding direction in the sliding bending test.

3 . A copper foil satisfying at least one of the following conditions (3-1) to (3-2):
(3-1) the copper foil has a number of cracks having a depth of 1 μm or more from a surface of the copper foil being 3 or less after a sliding bending test in a prescribed number of times under a prescribed condition for a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil, in an observation of a region having a size of a thickness of the copper foil×100 μm on a cross section of the copper foil in parallel to a sliding direction in the sliding bending test; (3-2) the copper foil has a number of cracks having a depth of 2 μm or more from a surface of the copper foil being 2 or less after a sliding bending test in a prescribed number of times under a prescribed condition for a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil, in an observation of a region having a size of a thickness of the copper foil×100 μm on a cross section of the copper foil in parallel to a sliding direction in the sliding bending test.

4 . The copper foil according to claim 1 , wherein the insulating substrate is any one of the following insulating substrates (A) to (C):
(A) a fluorine resin, (B) a polyimide resin having a dielectric dissipation factor of 0.01 or less, and (C) a liquid crystal polymer resin, and a condition for adhering the copper foil and the insulating substrate is any one of the following conditions (D) to (F): (D) for a case where the insulating substrate is the fluorine resin, a pressure of 5 MPa, a heating temperature and a heating time of 350° C. for 30 minutes, (E) for a case where the insulating substrate is the polyimide resin having a dielectric dissipation factor of 0.01 or less, a pressure of 4 MPa, a heating temperature and a heating time of any one of the following (E-1) to (E-4): (E-1) 370° C. for 0.8 second, (E-2) 370° C. for 2 seconds, (E-3) 350° C. for 4 seconds, and (E-4) 300° C. for 10 minutes, and (F) for a case where the insulating substrate is the liquid crystal polymer resin, a pressure of 3.5 MPa, a heating temperature and a heating time of 300° C. for 10 minutes.

5 . The copper foil according to claim 1 , wherein the insulating substrate is a polytetrafluoroethylene resin, a polyimide resin having a dielectric dissipation factor of 0.006 or less, or a liquid crystal polymer resin containing a copolymer of a hydroxybenzoate ester and a hydroxynaphthoate ester.

6 . The copper foil according to claim 1 , wherein the copper foil comprises a surface-treated surface on one surface or both surfaces of the copper foil, and the surface-treated surface has an arithmetic average surface roughness Ra of from 0.05 to 0.40 μm, a ten-point average surface roughness Rz of from 0.25 to 2.0 μm, and a surface area ratio A/B of from 1.5 to 3.0, wherein A represents a three-dimensional surface area measured with a laser microscope, and B represents a two-dimensional surface area in a planar view of a view field for measuring the three-dimensional surface area A.

7 . The copper foil according to claim 1 , wherein the copper foil has an average crystal grain size of 20 μm or more on a cross section in parallel to a thickness direction of the copper foil and in parallel to MD of the copper foil, after forming a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil.

8 . A copper foil, wherein the copper foil comprises a surface-treated surface on one surface or both surfaces of the copper foil, and the surface-treated surface has an arithmetic average surface roughness Ra of from 0.05 to 0.40 μm, a ten-point average surface roughness Rz of from 0.25 to 2.0 μm, and a surface area ratio A/B of from 1.5 to 3.0, wherein A represents a three-dimensional surface area measured with a laser microscope, and B represents a two-dimensional surface area in a planar view of a view field for measuring the three-dimensional surface area A.

9 . The copper foil according to claim 8 , wherein the copper foil has an average crystal grain size of 20 μm or more on a cross section in parallel to a thickness direction of the copper foil and in parallel to MD of the copper foil, after forming a copper-clad laminate board containing the copper foil having an insulating substrate adhered to the copper foil.

10 . The copper foil according to claim 1 , wherein the copper foil is a rolled copper foil.

11 . The copper foil according to claim 1 , wherein the copper foil is for attaching to a resin having a dielectric constant of 3.5 or less.

12 . The copper foil according to claim 1 , wherein the copper foil is for attaching to a liquid crystal polymer or a fluorine resin or a low induction polyimide resin.

13 . The copper foil according to claim 1 , wherein the copper foil is used in a copper-clad laminate board or a printed wiring board that is used under a high frequency exceeding 1 GHz.

14 . The copper foil according to claim 1 , satisfying at least one of the following conditions (14-1) to (14-10):
(14-1) the copper foil contains, on a surface of the copper foil, one or more layers selected from the group consisting of a roughening treatment layer, a heat resistance treatment layer, a rust prevention treatment layer, a chromate treatment layer, and a silane coupling treatment layer; (14-2) the copper foil contains, on a surface of the copper foil, one or more layers selected from the group consisting of a heat resistance treatment layer, a rust prevention treatment layer, a chromate treatment layer, and a silane coupling treatment layer; (14-3) the copper foil contains a heat resistance treatment layer or a rust prevention treatment layer on a surface of the copper foil, contains a chromate treatment layer on the heat resistance treatment layer or the rust prevention treatment layer, and contains a silane coupling treatment layer on the chromate treatment layer; (14-4) the copper foil contains a heat resistance treatment layer on a surface of the copper foil, contains a rust prevention treatment layer on the heat resistance treatment layer, contains a chromate treatment layer on the rust prevention treatment

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Fukuchi Ryo

Classifications

• C25D5/48

  After-treatment of electroplated surfaces · CPC title

• C25D9/08

  by cathodic processes · CPC title

• H05K2201/0355

  Metal foils · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title