Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
US-10448507-B2 · Oct 15, 2019 · US
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Patent family 59314150
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 59314150 |
| Family type | — |
| Earliest priority | Jan 15, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10448507B2 — Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna |
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US10448507B2 — Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna (published Oct 15, 2019)
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