Bonding system and associated apparatus and method

Patent metadata

Field	Value
Publication number	US-2017207191-A1
Application number	US-201614996907-A
Country	US
Kind code	A1
Filing date	Jan 15, 2016
Priority date	Jan 15, 2016
Publication date	Jul 20, 2017
Grant date	—

Abstract

A bonding system includes: a storage apparatus, including a chamber, wherein the chamber is configured to accommodate a first semiconductor wafer and a second semiconductor wafer transferred from a load port, and a gas is provided to the chamber to purge oxygen out of the chamber; a surface treatment station, configured to perform a surface activation upon the first and second semiconductor wafers transferred from the storage apparatus; a cleaning station, configured to remove undesirable substances from surfaces of the first and second semiconductor wafers transferred from the surface treatment station; and a pre-bonding station, configured to bond the first and second semiconductor wafers together to produce a bonded first and second semiconductor wafer pair, wherein the first and second semiconductor wafers are transferred from the cleaning station. An associated apparatus and method are also disclosed.

First claim

What is claimed is:

1 . A bonding system, comprising:
a storage apparatus, including a chamber, wherein the chamber is configured to accommodate a first semiconductor wafer and a second semiconductor wafer transferred from a load port, and a gas is provided to the chamber to purge oxygen out of the chamber; a surface treatment station, configured to perform a surface activation upon the first and second semiconductor wafers transferred from the storage apparatus; a cleaning station, configured to remove undesirable substances from surfaces of the first and second semiconductor wafers transferred from the surface treatment station; and a pre-bonding station, configured to bond the first and second semiconductor wafers together to produce a bonded first and second semiconductor wafer pair, wherein the first and second semiconductor wafers are transferred from the cleaning station.

2 . The bonding system of claim 1 , further comprising an annealing station, configured to perform a thermal annealing upon the bonded first and second semiconductor wafer pair to enhance bonding strength therebetween.

3 . The bonding system of claim 2 , wherein the bonded first and second semiconductor wafer pair is transferred back to the load port after the thermal annealing.

4 . The bonding system of claim 1 , wherein the bonding system is a hybrid bonding system.

5 . The bonding system of claim 1 , wherein the bonding system is located in open air.

6 . The bonding system of claim 1 , wherein the gas provided to the chamber of the storage apparatus is an inert gas.

7 . The bonding system of claim 6 , wherein the gas provided to the chamber of the storage apparatus is nitrogen.

8 . The bonding system of claim 1 , wherein the storage apparatus is further configured to accommodate a plurality of first semiconductor wafers and a plurality of second semiconductor wafers transferred from the load port in an interleaved way.

9 . The bonding system of claim 1 , wherein the gas is provided to the chamber of the storage apparatus for a specified time so as to allow the chamber to become substantially oxygen-free.

10 . An apparatus for temporarily storing a semiconductor wafer transferred from a load port before starting a bonding operation, the apparatus comprising:
a chamber, for accommodating a semiconductor wafer, the chamber comprising:
a door, configured to allow the semiconductor wafer to be transported into and out of the chamber; and
a nozzle, configured to provide a gas to the chamber; and
a gas source, configured to provide gas through the nozzle.

11 . The apparatus of claim 10 , wherein the bonding operation is a hybrid bonding operation.

12 . The apparatus of claim 10 , wherein the gas provided to the chamber is an inert gas.

13 . The apparatus of claim 12 , wherein the gas provided to the chamber is nitrogen.

14 . The apparatus of claim 10 , wherein the chamber further comprises a venting hole configured to lead oxygen out of the chamber.

15 . The apparatus of claim 10 , wherein the chamber further comprises:
a semiconductor wafer carrier; and a retractable wafer support, configured to adjust a height of the semiconductor wafer carrier.

16 . The apparatus of claim 10 , further comprising:
a control valve, connected between the nozzle and the gas source, wherein the control valve is configured to manipulate the gas provided into the chamber; and a controller, connected to the control valve, wherein the controller is configured to control the control valve.

17 . The apparatus of claim 14 , further comprising a sensor configured to monitor an ambient condition within the chamber.

18 . The apparatus of claim 10 , wherein the gas is provided to the chamber for a specified time so as to allow the chamber to become substantially oxygen-free.

19 . A bonding method, comprising:
utilizing a storage apparatus to accommodate a first semiconductor wafer and a second semiconductor wafer transferred from a load port; providing a gas to the storage apparatus to purge oxygen out of the storage apparatus; and transferring the first and second semiconductor wafers to following stations of a bonding system sequentially one after another; wherein the storage apparatus is substantially oxygen-free.

20 . The bonding method of claim 19 , wherein the stations of the bonding system comprise a surface treatment station, a cleaning station, a pre-bonding station and an annealing station.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• HUANG Xin-hua
• Liu Ping-Yin
• Liang Chin-Wei
• Lin Yeong-Jyh
• Liu Kuan-Liang
• Tsai Chia-Shiung

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W80/312

  characterised by the direct bonding of electrically conductive pads · CPC title

• H10W72/019

  of bond pads · CPC title

• H10W80/016

  Cleaning · CPC title