Rigid-Flex Assembly for High-Speed Sensor Modules

Patent metadata

Field	Value
Publication number	US-2017200529-A1
Application number	US-201615194427-A
Country	US
Kind code	A1
Filing date	Jun 27, 2016
Priority date	Jan 11, 2016
Publication date	Jul 13, 2017
Grant date	—

Abstract

A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

First claim

What is claimed is:

1 . A rigid-flex assembly for high-speed data transfer, the assembly comprising:
an electrical component attachable to a sensor, a flexible wiring section having a first end and a second end, the first end electrically coupled to the electrical component for transferring data gathered by the sensor, the flexible wiring section minimizing thermal transfer; a plurality of rigid substrates electrically coupled to the second end of the flexible wiring section; and a connector electrically coupled to the rigid substrates and attachable to a computer system for processing the data.

2 . The assembly of claim 1 , further comprising a controlled separation volume or gap defined by a distance between a first flexible strip and a second flexible strip of the flexible wiring section.

3 . The assembly of claim 2 , wherein the controlled separation gap is optimized between signal integrity and reduced thermal loads.

4 . The assembly of claim 2 , wherein the first flexible strip has a first set of electrical wires and the second flexible strip has a second set of electrical wires, wherein the sets of electrical wires oppose each other to form a microstrip topology having the controlled separation distance or volume.

5 . The assembly of claim 1 , wherein the assembly comprises only a single flexible wiring section coupled to the electrical component such that the electrical component, the rigid section, and the connector provides an end-launch, in-plane connection configuration for optimized signal integrity for each signal layer.

6 . The assembly of claim 1 , wherein the plurality of rigid substrates comprises two or more substrates electrically coupled to the connector, the two or more substrates electrically coupled to the flexible wiring section.

7 . The assembly of claim 1 , wherein the electrical component is an integrated circuit board assembly.

8 . The assembly of claim 1 , wherein the assembly is contained in a sensor module housing wherein the flexible wiring section is flexible therein.

9 . The assembly of claim 8 , wherein the sensor is a focal plane array module having output data from 1 bps to greater than 2.7 Gbps.

10 . The assembly of claim 1 , wherein the flexible wiring section is wrapped or covered with a low emissivity material that reduces thermal loads further while maintaining signal integrity.

11 . A sensor module for capturing and transferring data, the assembly comprising:
a housing; a sensor within the housing; a integrated circuit board assembly electrically coupled to the sensor; a flexible wiring section electrically coupled to the circuit board for transferring data gathered by the sensor; a rigid section electrically coupled to the flexible wiring section; and a connector electrically coupled to the rigid section and attachable to a computer system for processing data gathered from the sensor, wherein flexible wiring section is capable of high-speed data transfer for optimal signal integrity and thermal loss isolation.

12 . The sensor module of claim 11 , wherein the flexible wiring section includes a controlled separation distance or volume and is flexed within the housing.

13 . The sensor module of claim 12 , wherein the flexible wiring section includes a first flexible strip having a first set of electrical wires, and includes a second flexible strip having a second set of electrical wires, wherein the sets of electrical wires oppose each other within the controlled separation distance or volume.

14 . The sensor module of claim 11 , wherein the connector is an edge connector electrically coupled to the rigid section such that the integrated circuit board, the rigid section, and the connector provide an end-launch, in-plane connection configuration for optimized signal integrity.

15 . The sensor module of claim 11 , wherein the sensor is a focal plane array.

16 . The sensor module of claim 15 , wherein the output data speed of the focal plane array is from 1 bps to greater than 2.7 Gbps, and wherein the focal plane array operates from 373K to below 40K.

17 . The sensor module of claim 11 , wherein the connector further comprises a plurality contact flexures, and wherein the rigid section includes at least one substrate having a plurality of V-pads formed in the substrate and electrically coupled to the plurality of contact flexures to guide the installation and position the contact flexures separately from each other.

18 . A method of making a high-speed sensor module, the method comprising:
providing a housing; attaching a sensor within the housing; electrically attaching a rigid-flex assembly to the sensor, the rigid-flex assembly comprising:
an integrated circuit board electrically coupled to the sensor;
a flexible wiring section electrically coupled to the circuit board for transferring data gathered by the sensor;
a rigid section electrically coupled to the flexible wiring section; and
a connector electrically coupled to the rigid section and attachable to a computer system for processing data gathered by the sensor, wherein flexible wiring section is capable of high-speed data transfer for optimal signal integrity and to minimize thermal loss.

19 . The method of claim 18 , further comprising flexing the flexible wiring section within the housing, the flexible wiring section having a controlled separation distance or volume to minimize thermal loss.

20 . The method of claim 18 , further comprising making the flexible wiring section by decoupling a first flexible electrical strip to an opposing a electrical second flexible strip, each strip having electrical wiring for transferring data, whereby the flexible strips define a controlled separation distance or volume to minimize thermal loss.

21 . The method of claim 18 , further comprising arranging the integrated circuit board, the rigid section, and the connector into an end-launch, in-plane connection configuration such that the sensor output data speed is from 1 bps to greater than 2.7 Mbps and operates between 373K and below 40K.

22 . The method of claim 18 , further comprising spatially separating a plurality of rigid substrates of the rigid section from each other, and further comprising electrically attaching the plurality of rigid substrates to the connector with a plurality of contact flexures electrically connected to V-pads disposed on an upper surface and lower surface of each substrate.

23 . The assembly of claim 16 , further comprising covering or wrapping the flexible wiring section with a low emissivity material to reduce thermal loads further while maintaining signal integrity.

Assignees

• Raytheon Co

Inventors

• Neumann Jay R
• Mcewan Thomas F
• Sigurdson David E
• Perez Alberto
• Lambe Janine F
• Tracy Gregory D

Classifications

• H05K3/4691 Primary

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H01P3/08

  Microstrips; Strip lines · CPC title

• H05K2201/10189

  Non-printed connector · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title