Flexible interconnect structure for a sensor assembly

Patent metadata

Field	Value
Publication number	US-9518887-B2
Application number	US-201614989332-A
Country	US
Kind code	B2
Filing date	Jan 6, 2016
Priority date	Mar 15, 2013
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.

First claim

We claim:

1. A sensor assembly, comprising:
a housing;
a first sensor structure disposed on a first portion of the housing, the first sensor structure configured to measure a first pressure;
a second sensor structure disposed on a second portion of the housing, the second sensor structure configured to measure a second pressure;
a main connector disposed on a third portion of the housing, the main connector configured to interface with an external component;
a flexible interconnect structure connected to the first sensor structure, the second sensor structure, and the main connector, the flexible interconnect structure comprising:
a first rigid section coupled to and in electrical communication with the first sensor structure;
a first flexible section having a frontend in electrical communication with the first rigid section;
a second rigid section coupled to and in electrical communication with the second sensor structure, the second rigid section having a frontend in electrical communication with a backend of the first flexible section;
a second flexible section having a frontend in electrical communication with a backend of the second rigid section; and
a third rigid section coupled to and in electrical communication with the main connector, the third rigid section having a frontend in electrical communication with a backend of the second flexible section, wherein the third rigid section is configured to receive signals from the first sensor structure and the second sensor structure;

wherein each of the first rigid section, the second rigid section, and the third rigid section is an independently rigid printed circuit board (PCB) integrated with the flexible interconnect structure and wherein each of the first sensor structure and the second sensor structure comprises:
a header;
a sensor element; and
one or more header pins coupled to the header and electrically coupled to the sensor element.

2. The sensor assembly of claim 1 , wherein the housing forms a cavity, and wherein the first flexible section and the second flexible section are configured to bend within the cavity.

3. The sensor assembly of claim 1 , wherein the first rigid section and the second rigid section are further configured for mounting to the respective header and in electrical communication with the respective sensor element.

4. The sensor assembly of claim 1 , wherein one or more of the first sensor structure and the second sensor structure are configured for measuring pressure associated with a fluid.

5. The sensor assembly of claim 1 , wherein the first sensor structure and the second sensor structure are configured for measuring a difference in pressure.

6. The sensor assembly of claim 1 , wherein one or more of the first sensor structure and the second sensor structure are configured as redundant pressure sensors.

7. The sensor assembly of claim 1 , wherein the first sensor structure forms a first half of a Wheatstone bridge and the second sensor structure forms a second half of the Wheatstone bridge.

8. The sensor assembly of claim 1 , wherein the first sensor structure includes a first conductor and a second conductor, wherein the first conductor is coupled to a first connection point and the second conductor is coupled to a second connection point;
wherein the second sensor structure includes a third conductor and a fourth conductor, wherein the third conductor is coupled to a third connection point and the fourth conductor is coupled to a fourth connection point; and
wherein the main connector includes a fifth conductor, a sixth conductor and a seventh conductor, wherein the fifth conductor is coupled to a fifth connection point, the sixth conductor is coupled to a sixth connection point, and the seventh conductor is coupled to a seventh connection point.

9. The sensor assembly of claim 8 , wherein each of the first, second, third, fourth, fifth, sixth and seventh connection points is one or more of a through hole and plated.

10. A sensor assembly, comprising:
a housing;
a first sensor structure disposed on a first portion of the housing, the first sensor structure configured to measure a first pressure;
a second sensor structure disposed on a second portion of the housing, the second sensor structure configured to measure a second pressure; and
a flexible interconnect structure connected to the first sensor structure and the second sensor structure, the flexible interconnect structure configured to interface with an external component, the flexible interconnect structure comprising:
a first rigid section coupled to and in electrical communication with the first sensor structure;
a first flexible section having a frontend in electrical communication with the first rigid section;
a second rigid section coupled to and in electrical communication with the second sensor structure, the second rigid section having a frontend in electrical communication with a backend of the first flexible section;
a second flexible section having a frontend in electrical communication with a backend of the second rigid section; and
a third rigid section having a frontend in electrical communication with a backend of the second flexible section, wherein the third rigid section is configured to receive signals from the first sensor structure and the second sensor structure, and wherein the third rigid section is configured for coupling with the external component;

wherein each of the first rigid section, the second rigid section, and the third rigid section is an independently rigid printed circuit board (PCB) integrated with the flexible interconnect structure and wherein each of the first sensor structure and the second sensor structure comprises:
a header;
a sensor element; and
one or more header pins coupled to the header and electrically coupled to the sensor element.

11. The sensor assembly of claim 10 , wherein the housing forms a cavity, and wherein the first flexible section and the second flexible section are configured to bend within the cavity.

12. The sensor assembly of claim 10 , wherein the first rigid section and the second rigid section are further configured for mounting to the respective header and in electrical communication with the respective sensor element.

13. The sensor assembly of claim 10 , wherein one or more of the first sensor structure and the second sensor structure are configured for measuring pressure associated with a fluid.

14. The sensor assembly of claim 10 , wherein the first sensor structure and the second sensor structure are configured for measuring a difference in pressure.

15. The sensor assembly of claim 10 , wherein one or more of the first sensor structure and the second sensor structure are configured as redundant pressure sensors.

16. The sensor assembly of claim 10 , wherein the first sensor structure forms a first half of a Wheatstone bridge and the second sensor structure forms a second half of the Wheatstone bridge.

17. The sensor assembly of claim 10 , wherein the first sensor structure includes a first conductor and a second conductor, wherein the first conductor is coupled to a first connection point of the first rigid section and the second conductor is coupled to a second connection point of the first rigid section;
wherein the second sensor structure includes a third conductor and a fourth conductor, wherein the third conductor is coupled to a third connection point of the second rigid section and the fourth conductor is coupled to a fourth connection point of the second rigid section; and
wherein the external component includ

Assignees

• Kulite Semiconductor Products Inc

Inventors

• Derosa Louis
• Gardner Robert

Classifications

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• G01L19/14 Primary

  Housings {(G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence)} · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title