Optical module installing a semiconductor optical amplifier

Patent metadata

Field	Value
Publication number	US-2017194762-A1
Application number	US-201715462595-A
Country	US
Kind code	A1
Filing date	Mar 17, 2017
Priority date	Jul 9, 2014
Publication date	Jul 6, 2017
Grant date	—

Abstract

An optical module providing a semiconductor optical amplifier (SOA), and a process to assembly the optical module are disclosed. The optical module provides front and rear coupling units each optically coupled with the SOA and fixed to the housing enclosing the SOA. The housing has a slim wall fixing a lens holder soldered to the slim wall. The front and/or rear coupling unit is fixed to the lens holder by YAG laser welding after the active alignment by using a spontaneous emission of the SOA, and amplified emission of externally provided test beam.

First claim

1 - 8 . (canceled)

9 . An optical module, comprising:
an amplifier unit including a housing that encloses a semiconductor optical amplifier (SOA) therein, the housing having a front wall and a side wall; a lens holder that secures a lens optically coupled with the SOA, the lens holder being soldered to the front wall of the housing; and a coupling unit that receives an optical fiber therein, the coupling unit being welded to the lens holder, wherein the front wall has a thickness smaller than a thickness of the side wall.

10 . The optical module of claim 9 ,
wherein the housing further includes a rear wall opposite to the front wall, the rear wall having a thickness smaller than a thickness of the side wall, wherein the optical module further includes another lens holder soldered to the rear wall.

11 . The optical module of claim 10 ,
wherein the another lens holder secures another lens therein.

12 . The optical module of claim 9 ,
wherein the coupling unit includes an optical isolator that passes light going to the SOA but cuts another light coming from the SOA.

13 - 16 . (canceled)

17 . The optical module of claim 9 ,
wherein the front wall has a thickness less than a half of a thickness of the side wall.

Assignees

• Sedi Inc

Inventors

• Yamauchi Yasuyuki

Classifications

• G02B6/4237

  Welding · CPC title

• H01S5/50

  Amplifier structures not provided for in groups H01S5/02 - H01S5/30 · CPC title

• H01S5/02438

  Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens · CPC title

• H01S5/3434

  with a well layer comprising at least both As and P as V-compounds · CPC title

• G02B6/4208

  using non-reciprocal elements or birefringent plates, i.e. quasi-isolators (optical isolators per se G02F1/093, G02F1/0955) · CPC title