Devices and methods for infrared reference pixels

Patent metadata

Field	Value
Publication number	US-2017191868-A1
Application number	US-201715465505-A
Country	US
Kind code	A1
Filing date	Mar 21, 2017
Priority date	Dec 31, 2012
Publication date	Jul 6, 2017
Grant date	—

Abstract

A device is disclosed including a substrate and a floating blinded infrared detector and/or a shunted blinded infrared detector. The floating blinded infrared detector may include an infrared detector coupled to and thermally isolated from the substrate; and a blocking structure disposed above the infrared detector to block external thermal radiation from being received by the infrared detector; and wherein the blocking structure comprises a plurality of openings. The shunted blinded infrared detector may include an additional infrared detector coupled to the substrate; an additional blocking structure disposed above the infrared detector to block external thermal radiation from being received by the additional infrared detector; and a material that thermally couples the additional infrared detector to the substrate and the additional blocking structure. Methods for using and forming the device are also disclosed.

First claim

1 . A device, comprising:
a substrate; and a floating blinded infrared detector comprising:
a first infrared detector coupled to and thermally isolated from the substrate;
a first blocking structure coupled to the substrate, disposed at a distance from the first infrared detector, and configured to block external thermal radiation from being received by the first infrared detector; and
wherein the first blocking structure comprises a plurality of openings.

2 . The device of claim 1 , further comprising an array of infrared detectors, coupled to and thermally isolated from the substrate, configured to receive external thermal radiation to capture infrared image data.

3 . The device of claim 1 , further comprising:
a shunted blinded infrared detector comprising:
a second infrared detector coupled to the substrate;
a second blocking structure coupled to the substrate, disposed at a distance from the second infrared detector, and configured to block external thermal radiation from being received by the second infrared detector; and
a material disposed beneath the second blocking structure that thermally couples the second infrared detector to the substrate and to the second blocking structure.

4 . The device of claim 3 , further comprising a plurality of the shunted blinded infrared detectors and a plurality of the floating blinded infrared detectors.

5 . The device of claim 3 , further comprising:
a logic device; an array of infrared detectors, coupled to and thermally isolated from the substrate, configured to receive external thermal radiation to capture infrared image data; and wherein: the floating blinded infrared detector is configured to provide a detector reference signal; the shunted blinded infrared detector is configured to provide a substrate reference signal; and the logic device is configured to perform a temperature correction operation to the infrared image data based on the detector reference signal and/or the substrate reference signal.

6 . The device of claim 4 , wherein the floating blinded infrared detector comprises a cavity defined, at least in part, by the first infrared detector and the first blocking structure.

7 . The device of claim 1 , wherein a size of the openings is configured to prevent infrared radiation from passing through the openings.

8 . The device of claim 7 , wherein the size of the openings is configured to prevent infrared radiation with wavelengths of less than 14 microns from passing through the openings.

9 . The device of claim 1 , wherein the openings are configured to allow release materials to pass through the openings into the cavity.

10 . The device of claim 9 , wherein the first infrared detector is thermally isolated from the first blocking structure by the cavity.

11 . The device of claim 1 , wherein the first blocking structure further comprises a plurality of layers.

12 . The device of claim 11 , wherein the plurality of layers comprises a first insulating layer, a metal layer, and a second insulating layer.

13 . The device of claim 1 , wherein the substrate comprises a metal layer and a contact coupled to the metal layer, and wherein the first blocking structure is coupled to the contact.

14 . The device of claim 3 , wherein the substrate comprises a metal layer and a plurality of contacts coupled to the metal layer, and wherein the first blocking structure and the second blocking structure are each coupled to one or more of the contacts.

15 . The device of claim 14 , wherein at least one of the contacts is a basket-shaped contact or a stud contact.

16 . A method of generating infrared images, the method comprising:
capturing infrared image data using at least one infrared detector; performing a first temperature correction to the infrared image data using detector reference data obtained, at least in part, from a floating blinded infrared detector; and performing a second temperature correction to the infrared image data using substrate reference data obtained, at least in part, from a shunted blinded infrared detector.

17 . A method of manufacturing a device, the method comprising:
providing a substrate; forming an infrared detector coupled to the substrate; and forming a blocking structure coupled to the substrate and disposed above the infrared detector to block external infrared radiation from reaching the infrared detector.

18 . The method of claim 17 , wherein the forming the blocking structure comprises:
depositing a sacrificial material over the infrared detector and the substrate; faulting at least one insulating layer over the sacrificial material; and forming a metal layer over the insulating layer.

19 . The method of claim 18 , wherein the forming the blocking structure further comprises forming openings in the metal layer.

20 . The method of claim 19 , further comprising removing at least part of the sacrificial material by passing release materials through the openings.

Assignees

• Flir Systems

Inventors

• Kurth Eric A
• Chan Chris
• Peters Kevin
• Franklin Patrick
• Cannata Robert F
• Dale James L
• Marx Tommy
• Howard David
• Rose Jefferson
• Debar Michael

Classifications

• H10W90/00

  Package configurations · CPC title

• H01L27/14618

  Electricity · mapped topic

• G01J5/0245 Primary

  for performing thermal shunt · CPC title

• H01L25/042

  Electricity · mapped topic

• G01J1/0252 Primary

  Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices (protection against electromagnetic interferences G01J2001/0276) · CPC title