Compositions and methods for producing electrically conductive coordination polymers and uses thereof
US-2024018310-A1 · Jan 18, 2024 · US
Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
US2017190875A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017190875-A1 |
| Application number | US-201715468977-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 24, 2017 |
| Priority date | Feb 8, 2013 |
| Publication date | Jul 6, 2017 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
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A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.
First claim
Opening claim text (preview).
1 . A thermosetting resin composition comprising: a thermosetting resin containing a benzoxazine compound; and a curing accelerator containing a triazine thiol compound, wherein the thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound. 2 . The thermosetting resin composition according to claim 1 , wherein a gel time of the thermosetting resin composition at 200° C. is 7 minutes or less. 3 . The thermosetting resin composition according to claim 1 , wherein the triazine thiol compound includes a compound having three or more thiol groups in one molecule. 4 . The thermosetting resin composition according to claim 1 , wherein the triazine thiol compound includes a compound having a triazine ring and a thiol group directly bound to the triazine ring. 5 . The thermosetting resin composition according to claim 1 , wherein a percentage of the triazine thiol compound to an entirety of the thermosetting resin composition is within a range of 0.1 to 30% by mass. 6 . The thermosetting resin composition according to claim 1 , wherein the curing accelerator further includes imidazole. 7 . The thermosetting resin composition according to claim 1 , wherein the thermosetting resin further includes an epoxy resin. 8 . A prepreg obtained through impregnating a fiber base material with the thermosetting resin composition according to claim 1 , and semi-curing the thermosetting resin composition. 9 . A metal-clad laminate obtained through laminating the prepreg according to claim 8 with a metal foil, and hot-press molding the laminated prepreg. 10 . A resin sheet obtained through applying the thermosetting resin composition according to claim 1 onto a carrier sheet. 11 . A printed-wiring board comprising an insulating layer made of a cured material of the thermosetting resin composition according to claim 1 . 12 . A sealing material made of the thermosetting resin composition according to claim 1 .
Assignees
Inventors
Classifications
containing a filler · CPC title
Organic materials · CPC title
reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title
Insulating · CPC title
Electricity · mapped topic
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- What does patent US2017190875A1 cover?
- A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08K5/378. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Jul 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).