Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same

Patent metadata

Field	Value
Publication number	US-9617144-B2
Application number	US-201414273845-A
Country	US
Kind code	B2
Filing date	May 9, 2014
Priority date	May 9, 2014
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

First claim

What is claimed is:

1. A device comprising:
a package;
a MEMS acoustic sensing element comprising a diaphragm disposed in the package;
an integrated circuit (IC) disposed in the package and comprising an IC substrate having an environmental sensing material of an environmental sensor disposed in the IC substrate, wherein the environmental sensor comprises the environmental sensing material in a configuration sensitive to a change in an environmental characteristic independent of pressure experienced by the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor, and wherein the IC is configured to process data generated by the MEMS acoustic sensing element and the environmental sensor; and
a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the environmental sensor; wherein,
the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC comprising the environmental sensor.

2. The device of claim 1 , wherein the MEMS acoustic sensing element includes a MEMS microphone.

3. The device of claim 1 , wherein the environmental sensor includes one of a humidity, gas, temperature, chemical, biological parameter, nanoparticles, spore, or pathogen sensor.

4. The device of claim 1 , wherein the port includes one of a square, rectangular or circular shaped cavity.

5. The device of claim 1 , wherein the environmental sensor is disposed in a manner that is aligned with the port.

6. A method for making a package comprising:
forming a package substrate;
forming a MEMS acoustic sensor element on the package substrate;
forming an application specific integrated circuit (ASIC) chip above the package substrate comprising forming an ASIC substrate having an environmental sensing material of an environmental sensor disposed in the ASIC substrate, wherein the environmental sensor comprises the environmental sensing material in a configuration sensitive to a change in an environmental characteristic independent of pressure experienced by the environmental sensor, wherein the forming the ASIC chip includes depositing a plurality of segments of the environmental sensing material interspersed between a plurality of metal electrodes in direct contact with the environmental sensing material, thereby fabricating an environmental sensor arrangement that provides a variable electrical characteristic in response to the change in the environmental characteristic, and includes configuring at least one of the plurality of metal electrodes as a heating element of the environmental sensor;
forming electrical connections between the ASIC chip and the MEMS acoustic sensor element and between the ASIC chip and the environmental sensor;
forming a cover attached to the package substrate, wherein the cover defines a back cavity that encompasses the MEMS acoustic sensor element and the ASIC chip comprising the environmental sensor; and
forming an opening in the package, wherein the opening is configured to receive sound waves and air flow.

7. The method of claim 6 , wherein forming the package substrate includes forming a laminate substrate.

8. The method of claim 6 , wherein forming the environmental sensor includes aligning the environmental sensor with the opening.

9. An integrated circuit chip comprising:
a substrate;
a port disposed in the substrate;
an environmental sensor aligned with the port;
an application specific integrated circuit (ASIC) disposed above the substrate and comprising an environmental sensing material of the environmental sensor, wherein the environmental sensor comprises the environmental sensing material in a configuration sensitive to a change in an environmental characteristic unrelated to pressure experienced by the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor;
a MEMS acoustic sensor element disposed above the ASIC, wherein the ASIC is configured to process data generated by the MEMS acoustic sensor element and the environmental sensor; and
a cover attached to the substrate, wherein the cover defines a back cavity that encompasses the MEMS acoustic sensor element and the ASIC comprising the environmental sensor.

10. An integrated circuit chip comprising:
a substrate;
a port disposed in the substrate;
an application specific integrated circuit (ASIC) mechanically affixed directly to the substrate and comprising an environmental sensing material of an environmental sensor, wherein the environmental sensor comprises the environmental sensing material in a configuration insensitive to a change in pressure experienced by the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor;
a MEMS acoustic sensor element disposed above the port and mechanically affixed directly to the substrate apart from and adjacent to the ASIC; and
a cover attached to the substrate, wherein the cover defines a back cavity that encompasses the MEMS acoustic sensor element and the ASIC comprising the environmental sensor.

Assignees

• Invensense Inc

Inventors

• Tsai Julius Ming-Lin
• Cagdaser Baris
• Lim Martin
• Khenkin Aleksey S

Classifications

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• B81C1/0023

  Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261) · CPC title

• B81B2201/0278

  Temperature sensors · CPC title