Electrically conductive adhesives, assemblies including the electrically conductive adhesives, and related methods

Patent metadata

Field	Value
Publication number	US-2017145264-A1
Application number	US-201514951376-A
Country	US
Kind code	A1
Filing date	Nov 24, 2015
Priority date	Nov 24, 2015
Publication date	May 25, 2017
Grant date	—

Abstract

An assembly comprising a first article, a second article adjacent the first article, and an electrically conductive adhesive in electrical communication with the first article and the second article. The electrically conductive adhesive comprises nickel nanostrands dispersed in a matrix comprising a reaction product of bisphenol-F epoxy resin, resorcinol diglycidyl ether epoxy monomer, and at least one amine-containing curing agent. The electrically conductive adhesive exhibits a tensile adhesion strength greater than about 5,000 psi and a volume resistivity less than about 0.01 Ω·cm. Electrically conductive adhesives including nickel nanostrands, precursor packages of the electrically conductive adhesive, related methods of forming the electrically conductive adhesive and an assembly including the electrically conductive adhesive are also disclosed.

First claim

What is claimed is:

1 . An assembly, comprising:
a first article; a second article adjacent the first article; and an electrically conductive adhesive comprising nickel nanostrands dispersed in a matrix comprising a reaction product of bisphenol-F epoxy resin, resorcinol diglycidyl ether epoxy monomer, and at least one amine-containing curing agent in electrical communication with the first article and the second article, wherein the electrically conductive adhesive exhibits a tensile adhesion strength greater than about 5,000 psi and a volume resistivity less than about 0.01 Ω·cm.

2 . The assembly of claim 1 , wherein the electrically conductive adhesive comprises between about two volume percent and about fifteen volume percent nickel nanostrands.

3 . The assembly of claim 1 , wherein the electrically conductive adhesive further comprises another electrically conductive filler dispersed in the matrix.

4 . The assembly of claim 1 , wherein the electrically conductive adhesive exhibits a tensile adhesion strength greater than about 6,000 psi.

5 . The assembly of claim 1 , wherein the electrically conductive adhesive exhibits a volume resistivity less than about 0.005 Ω·cm.

6 . The assembly of claim 1 , wherein at least one of the first article and the second article comprises a thermally insulative composite material.

7 . The assembly of claim 1 , wherein at least one of the first article and the second article comprises an electrically conductive metallic mesh or an electrically conductive nonwoven material.

8 . The assembly of claim 1 , wherein at least one of the first article and the second article comprises a bond strap and wherein the bond strap electrically connects the other of the first article and the second article to a third article.

9 . The assembly of claim 1 , wherein the first article and the second article each comprise a thermally insulative, electrically conductive material.

10 . An electrically conductive adhesive, comprising
between about two volume percent and about fifteen volume percent nickel nanostrands dispersed within an adhesive matrix material, the adhesive matrix material comprising:
a reaction product of bisphenol-F epoxy resin and resorcinol diglycidyl ether epoxy monomer and at least one amine curing agent,
wherein the electrically conductive adhesive exhibits a tensile strength greater than about 5,000 psi and a volume resistivity less than about 0.01 Ω·cm.

11 . The electrically conductive adhesive of claim 10 , wherein the electrically conductive adhesive exhibits a tensile adhesion strength of at least about 6,000 psi.

12 . The electrically conductive adhesive of claim 10 , wherein the adhesive matrix material comprises about ten volume percent nickel nanostrands dispersed therein.

13 . The electrically conductive adhesive of claim 10 , wherein the at least one amine curing agent comprises a polyetheramine.

14 . The electrically conductive adhesive of claim 10 , further comprising silver-coated microspheres dispersed within the adhesive matrix material.

15 . The electrically conductive adhesive of claim 10 , wherein the electrically conductive adhesive comprises:
about fifteen volume percent of the nickel nanostrands; and between about two and about three parts bisphenol-F epoxy resin per one part diglycidyl ether epoxy monomer.

16 . The electrically conductive adhesive of claim 10 , wherein the adhesive matrix material comprises about 7 parts by weight of the bisphenol-F epoxy resin for every about 3 parts by weight of the resorcinol diglycidyl ether epoxy monomer.

17 . The electrically conductive adhesive of claim 10 , wherein the electrically conductive adhesive exhibits a density less than about 2.5 g/cm 3 .

18 . A method of forming an assembly, the method comprising:
providing at least a first article and at least a second article; and disposing an electrically conductive adhesive comprising nickel nanostrands and exhibiting a tensile adhesion strength greater than about 5,000 psi and a volume resistivity less than about 0.01 Ω·cm between a surface of the first article and a surface of the second article to electrically interconnect the first article and the second article.

19 . The method of claim 18 , further comprising selecting at least one of the at least a first article and the at least a second article to comprise at least one of a composite material, a ground strip, or a bond strap.

20 . The method of claim 18 , further comprising forming the electrically conductive adhesive from bisphenol-F epoxy resin, resorcinol diglycidyl ether epoxy monomer, and at least one amine-containing curing agent.

21 . A precursor package for forming an electrically conductive adhesive exhibiting a tensile adhesion strength greater than about 5000 psi and a volume resistivity less than about 0.01 Ω·cm when mixed, the precursor package comprising:
a first part comprising a mixture of bisphenol-F epoxy resin and resorcinol diglycidyl ether epoxy monomer;
a second part comprising an amine-terminated curing agent; and
nickel nanostrands dispersed in at least one of the first part and the second part.

22 . The precursor package of claim 21 , wherein the mixture comprises about 7 parts by weight of the bisphenol-F epoxy resin for every about 3 parts by weight of the resorcinol diglycidyl ether epoxy monomer.

23 . The precursor package of claim 21 , further comprising nickel nanostrands dispersed in each of the first part and the second part.

24 . The precursor package of claim 21 , wherein the nickel nanostrands dispersed in the at least one of the first part and the second part constitute between about 10 weight percent and about 30 weight percent of at least one of the first part and the second part.

25 . The precursor package of claim 21 , further comprising silver microspheres in at least one of the first part and the second part.

26 . The precursor package of claim 21 , wherein the second part further comprises at least one curing promoter.

Assignees

• Orbital Atk Inc

Inventors

• Larson Robert S

Classifications

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• B32B2307/202

  Conductive · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B2605/18

  Aircraft · CPC title