Systems, compositions, and methods for enhanced electromagnetic shielding and corrosion resistance
US-11965116-B2 · Apr 23, 2024 · US
Curable composition for electronic component and connection structure
US2015340120A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015340120-A1 |
| Application number | US-201414758220-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 16, 2014 |
| Priority date | Jan 17, 2013 |
| Publication date | Nov 26, 2015 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.
First claim
Opening claim text (preview).
1 . A curable composition for an electronic component, containing an epoxy compound, an anionic curing agent, a flux, a basic compound that is not an anionic curing agent in the curable composition for an electronic component, and a conductive particle. 2 . (canceled) 3 . (canceled) 4 . The curable composition for an electronic component according to claim 1 , wherein the content of the basic compound is 0.1 parts by weight or more and 10 parts by weight or less relative to 100 parts by weight of the epoxy compound. 5 . The curable composition for an electronic component according to claim 1 , wherein the content of the flux is 0.5 parts by weight or more and 15 parts by weight or less relative to 100 parts by weight of the epoxy compound. 6 . The curable composition for an electronic component according to claim 1 , wherein the basic compound is benzylamine. 7 . The curable composition for an electronic component according to claim 1 , wherein the anionic curing agent is an imidazole compound. 8 . (canceled) 9 . The curable composition for an electronic component according to claim 1 , wherein the conductive particle is a conductive particle whose conductive outside surface is a solder. 10 . A connection structure comprising: a first connection object member; a second connection object member; and a connection part that connects between the first connection object member and the second connection object member, wherein the connection part is formed by curing a curable composition for an electronic component according to claim 1 . 11 . The connection structure according to claim 10 , wherein the curable composition for an electronic component contains a conductive particle, the first connection object member has a first electrode on a surface thereof, the second connection object member has a second electrode on a surface thereof, and the first electrode and the second electrode are electrically connected by the conductive particle.
Assignees
Inventors
Classifications
characterised by the curing agents used · CPC title
Electrically-conducting adhesives · CPC title
Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode · CPC title
Amines; Quaternary ammonium compounds · CPC title
- H01B1/22Primary
the conductive material comprising metals or alloys · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2015340120A1 cover?
- Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.
- Who is the assignee on this patent?
- Sekisui Chemical Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).