Substrate processing apparatus and substrate processing method using the same

Patent metadata

Field	Value
Publication number	US-2017137938-A1
Application number	US-201615289903-A
Country	US
Kind code	A1
Filing date	Oct 10, 2016
Priority date	Nov 17, 2015
Publication date	May 18, 2017
Grant date	—

Abstract

The present disclosure relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly, to a substrate processing apparatus that is capable of improving a flow of a process gas that is participated in a substrate processing process and a substrate processing method using the same. The substrate processing apparatus in accordance with an exemplary embodiment includes a pre-chamber into a substrate is carried, a process chamber communicating with the pre-chamber and in which a substrate processing process is performed, a substrate boat including a plurality of partition plates that partition a loading space into which the substrate is loaded and to elevate, a gas supply unit configured to supply a process gas to the substrate through a plurality of injection nozzles provided in the process chamber, an exhaust unit configured to exhaust a gas through a plurality of suction holes defined in the process chamber, and a swap guide member provided in the pre-chamber and configured to place the substrate carried into the pre-chamber in the loading space that is partitioned by the plurality of partition plates.

First claim

What is claimed is:

1 . A substrate processing apparatus comprising:
a pre-chamber into which a substrate is carried; a process chamber communicating with the pre-chamber and in which a substrate processing process is performed; a substrate boat comprising a plurality of partition plates to partition a loading space into which the substrate is loaded and to elevate; a gas supply unit configured to supply a process gas to the substrate through a plurality of injection nozzles provided in the process chamber; an exhaust unit configured to exhaust a gas through a plurality of suction holes provided in the process chamber; and a swap guide member provided in the pre-chamber and configured to place the substrate carried into the pre-chamber in the loading space that is partitioned by the plurality of partition plates.

2 . The substrate processing apparatus of claim 1 , wherein the swap guide member comprises:
a support part on which the substrate is supported; and a driving part connected to the support part to move the support part.

3 . The substrate processing apparatus of claim 2 , wherein the support part comprises an aligning stepped part on an end thereof on which the substrate is supported.

4 . The substrate processing apparatus of claim 1 , wherein each of the partition plates comprises a guide slot through which at least a portion of the swap guide member passes when the substrate boat is elevated.

5 . The substrate processing apparatus of claim 4 , wherein the guide slot has an area corresponding to 0.1% to 10% of an area of the partition plate.

6 . The substrate processing apparatus of claim 1 , wherein the substrate boat further comprises a connection bar configured to support the partition plate, and
the connection bar or the partition plate comprises a substrate support tip on which the substrate transferred from the swap guide member is placed.

7 . The substrate processing apparatus of claim 1 , further comprising a cover plate disposed under the substrate boat to block a path between the pre-chamber and the process chamber by an ascending of the substrate boat.

8 . The substrate processing apparatus of claim 1 , wherein the pre-chamber comprises a gate slit through which the substrate is carried into the pre-chamber and taken out from the pre-chamber, and
the swap guide member is disposed at a height corresponding to the gate slit.

9 . A substrate processing method using a substrate processing apparatus comprising: a pre-chamber into which a substrate is carried; a process chamber communicating with the pre-chamber and in which a substrate processing process is performed; a substrate boat that loads the substrate in a loading space partitioned in multi stages; and a plurality of swap guide members to place the substrate in the loading space, the substrate processing method comprises:
carrying the substrate into the pre-chamber; transferring the substrate on the plurality of swap guide members; lifting the substrate boat to place the substrate in the loading space; and moving the substrate boat to the process chamber.

10 . The substrate processing method of claim 9 , wherein the substrate boat comprises:
a plurality of partition plates partitioning the loading space; and a plurality of connection bars supporting the plurality of partition pates, wherein, in the lifting of the substrate boat, the substrate is placed on a substrate support tip formed on each of the plurality of connection bars or the plurality of partition plates.

11 . The substrate processing method of claim 10 , wherein each of the plurality of partition plates comprises a guide slot through which at least a portion of the plurality of swap guide members passes, and
in the lifting of the substrate boat, each of the plurality of swap guide members passes through the guide slot by an ascending of the substrate boat.

12 . The substrate processing method of claim 9 , further comprising adjusting a distance between the plurality of swap guide members.

Assignees

• Eugene Technology Co Ltd

Inventors

• Hyon Jun Jin
• Je Sung Tae
• Song Byoung Gyu
• Kim Yong Ki
• Kim Kyong Hun
• Kim Chang Dol
• Shin Yang Sik
• Kim Jae Woo

Classifications

• H10P72/127

  characterised by the substrate support · CPC title

• H10P14/3411

  Silicon, silicon germanium or germanium · CPC title

• H10P14/24

  using chemical vapour deposition [CVD] · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3312

  Vertical transfer of a batch of workpieces · CPC title