Thermal interface material with ion scavenger

Patent metadata

Field	Value
Publication number	US-2017137685-A1
Application number	US-201415322691-A
Country	US
Kind code	A1
Filing date	Jul 7, 2014
Priority date	Jul 7, 2014
Publication date	May 18, 2017
Grant date	—

Abstract

A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

First claim

1 . A thermal interface material comprising:
at least one polymer; at least one thermally conductive filler; and at least one ion scavenger.

2 . The thermal interface material of claim 1 , wherein the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents, and combinations of the foregoing.

3 . The thermal interface material of claim 1 , wherein the ion scavenger is selected from the group consisting of: an acid amide compound, a triazole compound, a tetrazole compound, a triazene compound, an oxamide compounds, a malonamide compound, and combinations of the foregoing.

4 . The thermal interface material of claim 1 , wherein the ion scavenger is an acid amide compound.

5 . The thermal interface material of claim 1 , wherein the ion scavenger is a selected from the group consisting of hydrazide, dihydrazide and combinations of the foregoing.

6 . The thermal interface material of claim 1 , wherein the ion scavenger is selected from the group consisting of: decamethylenedicarboxylic acid disalicyloylhydrazide; 3-(N-salicyloyl)amino-1,2,4-triazole; and 2′, 3-bis [[3-[3, 5-di-tert-butyl-4-hydroxyphenyl]propionic]]propionyl hydrazide.

7 . The thermal interface material of claim 1 , wherein the ion scavenger a compound according to a formula selected from the group consisting of Formula I to Formula XI or combinations thereof:

8 . The thermal interface material of claim 1 , wherein the thermal interface material comprises 0.1 wt. % to 5 wt. % of the ion scavenger, based on the total weight of the thermal interface material.

9 . (canceled)

10 . The thermal interface material of claim 1 , further comprising at least one phase change material.

11 . (canceled)

12 . The thermal interface material of claim 1 , further comprising at least one coupling agent, wherein the at least one coupling agent is selected from the group consisting of: a titanate coupling agent, a zirconate coupling agent, a silane coupling agent, and combinations of the foregoing.

13 . (canceled)

14 . The thermal interface material of claim 1 , further comprising at least one crosslinker.

15 . (canceled)

16 . The thermal interface material of claim 1 , wherein the thermal interface material comprises:
5 wt. % to 10 wt. % of the at least one polymer; 50 wt. % to 95 wt. % of the at least one thermally conductive filler; and 0.1 wt. % to 5 wt. % of the ion scavenger, based on the total weight of the thermal interface material.

17 . The thermal interface material of claim 16 , further comprising:
2 wt. % to 5 wt. % of at least one wax; 0.1 to 0.5 wt. % of at least one antioxidant; 1 wt. % to 2 wt. % of at least one coupling agent; and 0.5 wt. % to 0.6 wt. % of at least one crosslinker based on the total weight of the thermal interface material; wherein the thermal interface material comprises 75 wt. % to 90 wt. % of the at least one thermally conductive filler, based on the total weight of the thermal interface material.

18 . The thermal interface material of claim 16 , further comprising:
1.5 wt. % to 2 wt. % of at least one wax; 0.1 to 1 wt. % of at least one antioxidant; and 0.5 wt. % to 1 wt. % of at least one coupling agent; wherein the thermal interface material comprises 85 wt. % to 95 wt. % of the at least one thermally conductive filler, based on the total weight of the thermal interface material.

19 . The thermal interface material of claim 18 , further comprising 0.1 wt. % to 1 wt. % of at least one crosslinker.

20 . An electronic component comprising:
a heat sink; an electronic chip; a thermal interface material having a first surface layer and a second surface layer, the thermal interface material positioned between the heat sink and electronic chip, the thermal interface material including:
at least one polymer;
at least one thermally conductive filler; and

at least one ion scavenger.

21 . The thermal interface material of claim 1 , wherein the thermally conductive filler comprises a metal selected from aluminum, copper, silver, zinc, nickel, tin, indium, and lead.

22 . The thermal interface material of claim 1 , wherein the thermally conductive filler comprises a nonmetal, metal oxide, or ceramics selected from carbon, graphite, carbon nanotubes, carbon fibers, graphenes, silicon nitride, alumina, aluminum nitride, boron nitride, zinc oxide, and tin oxide.

23 . The thermal interface material of claim 1 , wherein the thermally conductive filler comprises a metal oxide selected from alumina, boron nitride, zinc oxide, and tin oxide.

24 . The electronic component of claim 20 , wherein the electronic component is selected from a central processing unit, a video graphics array, a server, a game console, a smart phone, or an LED board.

Assignees

• Liu Ya Qun
• Zeng Liang
• Wang Hui
• Zhang Bright
• Huang Hong Min
• Honeywell Int Inc

Inventors

• Liu Ya Qun
• Zeng Liang
• Wang Hui
• Zhang Bright
• Huang Hong Min

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title