Bonding Stage and Bonding Apparatus Comprising the Same

Patent metadata

Field	Value
Publication number	US-2017136570-A1
Application number	US-201615340303-A
Country	US
Kind code	A1
Filing date	Nov 1, 2016
Priority date	Nov 18, 2015
Publication date	May 18, 2017
Grant date	—

Abstract

A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.

First claim

What is claimed is:

1 . A bonding stage, comprising:
a first heater; a second heater adjacent the first heater; a cooler disposed under the first and second heaters, wherein the cooler is configured to block heat transfer from the first heater and heat transfer from the second heater to lower portions of the first and second heaters; and a thin plate disposed on the first heater and the second heater, wherein the thin plate is configured to support a substrate having a plurality of semiconductor chips disposed thereon, and wherein the thin plate transfers heat from the first and second heaters to the substrate, wherein the first and second heaters are independently operated.

2 . The bonding stage of claim 1 , wherein the cooler comprises:
a first cooler disposed under the first heater; and a second cooler disposed under the second heater.

3 . The bonding stage of claim 2 , wherein the first cooler comprises a first cooling pipe penetrating an inside of the first cooler, wherein the second cooler comprises a second cooling pipe penetrating an inside of the second cooler, wherein a temperature of the first cooler is lowered via a cooling fluid induced through the first cooling pipe, and wherein a temperature of the second cooler is lowered via a cooling fluid induced through the second cooling pipe.

4 . The bonding stage of claim 1 , further comprising:
a first insulating unit disposed between the first heater and the cooler, wherein the first insulating unit is configured to reduce heat transfer from the first heater to the cooler; and a second insulating unit disposed between the second heater and the cooler, wherein the second insulating unit is configured to reduce heat transfer from the second heater to the cooler.

5 . The bonding stage of claim 4 , wherein the first and insulating units each comprise ceramic material having low thermal conductivity.

6 . The bonding stage of claim 1 , further comprising a heater insulating unit disposed between the first heater and the second heater that is configured to reduce heat exchange between the first heater and the second heater.

7 . The bonding stage of claim 1 , wherein the thin plate comprises a ceramic material having high thermal conductivity.

8 . The bonding stage of claim 1 , wherein the first heater is configured to be operated while the second heater is not operated, and wherein the second heater is configured to be operated while the first heater is not operated.

9 . A bonding apparatus comprising:
a bonding head configured to apply pressure and heat to a plurality of semiconductor chips disposed on a substrate; a first heater disposed under a first region of the substrate; a second heater disposed under a second region different from the first region of the substrate; a cooler disposed under the first and second heaters, wherein the cooler is configured to block heat transfer from the first heater and heat transfer from the second heater to lower portions of the first and second heaters; a heater cooler disposed between the first and second heaters and the cooler, wherein the heater cooler is configured to cool the first heater and the second heater; and a thin plate disposed on the first heater and the second heater, wherein the thin plate supports the substrate and transfers heat from the first and second heaters to the substrate.

10 . The bonding apparatus of claim 9 , further comprising an insulating unit disposed between the heater cooler and the cooler, wherein the insulating unit is configured to reduce heat transfer from the first and second heaters to the cooler.

11 . The bonding apparatus of claim 10 , wherein the heater cooler comprises:
a first heater cooler disposed between the first heater and the insulating unit, wherein the first heater cooler is configured to cool the first heater; and a second heater cooler disposed between the second, heater and the insulating unit, wherein the second heater cooler is configured to cool the second heater.

12 . The bonding apparatus of claim 11 , wherein the first heater cooler comprises a first heater cooling pipe penetrating an inside of the first heater cooler, wherein the second heater cooler comprises a second heater cooling pipe penetrating an inside of the second heater cooler, wherein a temperature of the first heater cooler is lowered via a cooling fluid induced through the first heater cooling pipe, and wherein a temperature of the second heater cooler is lowered via a cooling fluid induced through the second heater cooling pipe.

13 . The bonding apparatus of claim 11 , wherein the first heater and the first heater cooler are configured to be operated independently of the second heater and the second heater cooler.

14 . The bonding apparatus of claim 9 , wherein when the bonding head is positioned at the first heater, the second heater is configured to start operating before operation of the first heater is interrupted, and when the bonding head is moved to the second heater, operation of the first heater is interrupted.

15 . The bonding apparatus of claim 9 , wherein the first and second heaters each comprise a ceramic material having high thermal conductivity.

16 . A bonding apparatus, comprising:
a bonding stage that supports a substrate, wherein the bonding stage comprises:
a first heater;
a second heater adjacent the first heater;
a thin plate disposed on the first and second heaters, wherein the thin plate supports the substrate having a plurality of semiconductor chips disposed thereon, and wherein the thin plate transfers heat from the first and second heaters to the substrate; and
a cooler disposed under the first and second heaters, wherein the cooler blocks heat transfer from the first and second heaters to lower portions of the first and second heaters; and
a bonding head operatively associated with the bonding stage, wherein the bonding head is configured to apply pressure and heat to each of the plurality of semiconductor chips disposed on the substrate.

17 . The bonding apparatus of claim 16 , wherein the first and second heaters are independently operated.

18 . The bonding apparatus of claim 16 , wherein the cooler comprises:
a first cooler disposed under the first heater, wherein the first cooler comprises a first cooling pipe, and wherein a temperature of the first cooler is lowered via a cooling fluid induced through the first cooling pipe; and a second cooler disposed under the first heater, wherein the second cooler comprises a second cooling pipe, and wherein a temperature of the second cooler is lowered via a cooling fluid induced through the second cooling pipe.

19 . The bonding apparatus of claim 16 , further comprising:
a first insulating unit disposed between the first heater and the cooler, wherein the first insulating unit is configured to reduce heat transfer from the first heater to the cooler; and a second insulating unit disposed between the second heater and the cooler, wherein the second insulating unit is configured to reduce heat transfer from the second heater to the cooler.

20 . The bonding apparatus of claim 19 , wherein the first and second insulating units comprise ceramic material having a first thermal conductivity, and wherein the thin plate comprises a ceramic material having a second thermal conductivity that is higher than the first thermal conductivity.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Seok Seung Dae
• Kim Sang Yoon
• Kim Hui Jae
• Shin Jae Bong
• Lee Byung Joon

Classifications

• H10W72/07188

  Apparatus chuck · CPC title

• H10W72/07152

  Means for cooling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/0711 Primary

  Apparatus therefor · CPC title

• B23K20/026 Primary

  with diffusion of soldering material · CPC title