Bonding head and die bonding apparatus having the same

Patent metadata

Field	Value
Publication number	US-9620476-B2
Application number	US-201414532190-A
Country	US
Kind code	B2
Filing date	Nov 4, 2014
Priority date	Nov 13, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

First claim

What is claimed is:

1. A bonding head for bonding a die to a substrate, the bonding head comprising:
a body connected to a driving section for transferring the die;
a plate heater mounted to a lower surface of the body; and
a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure, wherein
a cooling channel is formed at the lower surface of the body, and
cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

2. The bonding head of claim 1 , wherein first and second cooling channels are formed at the lower surface of the body, and the cooling passages comprise first and second supply passages connected with the first and second cooling channels and first and second recovery passages connected with the first and second cooling channels.

3. The bonding head of claim 2 , wherein the first and second cooling channels are disposed on both sides of a central portion of the plate heater, respectively.

4. The bonding head of claim 1 , wherein through-holes connected with each other are formed through the plate heater and the collet, and a vacuum passage connected with the through-hole of the plate heater is formed through the body.

5. The bonding head of claim 1 , wherein at least one vacuum channel is formed at the lower surface of the plate heater to vacuum-absorb the collet, and a vacuum passage connected with the vacuum channel is formed through the body.

6. The bonding head of claim 5 , wherein an inner vacuum channel surrounding a central portion of the plate heater and an outer vacuum channel surrounding the inner vacuum channel are formed at the lower surface of the plate heater.

7. The bonding head of claim 6 , wherein inner and outer vacuum passages connected with the inner and outer vacuum channels, respectively, are formed through the body, and the inner and outer vacuum passages are disposed on both sides of the central portion of the plate heater, respectively.

8. The bonding head of claim 1 , further comprising a temperature sensor for measuring a temperature of the plate heater.

9. The bonding head of claim 1 , wherein the body comprising:
a mounting block connected to the driving section; and
an adiabatic block mounted to a lower portion of the mounting block, wherein
the cooling channel is formed at a lower surface of the adiabatic block.

10. The bonding head of claim 1 , wherein the body comprising:
a mounting block connected to the driving section;
an adiabatic block mounted to a lower portion of the mounting block; and
a spacer mounted to a lower surface of the adiabatic block, wherein
the cooling channel is formed at a lower surface of the spacer.

11. The bonding head of claim 10 , wherein cooling fins are disposed in the cooling channel.

12. The bonding head of claim 10 , wherein an upper cooling channel is formed at an upper surface of the spacer, and the cooling channel and the upper cooling channel are connected by through-holes with each other.

13. An apparatus for bonding a die to a substrate, the apparatus comprising:
a driving section for transferring the die;
a bonding head comprising a body connected to the driving section, a plate heater mounted to a lower surface of the body, and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure; and
a cooling module connected with the bonding head, wherein
a cooling channel is formed at the lower surface of the body,
cooling passages are formed through the body to connect the cooling channel with the cooling module, and
the cooling module supplies a cooling fluid into the cooling channel and recovers the cooling fluid from the cooling channel so as to cool the plate heater.

14. The apparatus of claim 13 , wherein an air is used as the cooling fluid, and the cooling module is connected with the cooling passages by a supply pipe and a recovery pipe for supplying and recovering the air.

15. The apparatus of claim 14 , wherein the cooling module comprises an exhausting device connected with the recovery pipe.

Assignees

• Semes Co Ltd
• Samsung Electronics Co Ltd

Inventors

• Lee Hang Lim
• Weon Jong Jin
• Kim Soon Hyun
• Seok Seung Dae

Classifications

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07152

  Means for cooling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/01365

  Thermally treating (reflowing H10W72/01357) · CPC title