Power Conversion Apparatus

Patent metadata

Field	Value
Publication number	US-2017069562-A1
Application number	US-201415123355-A
Country	US
Kind code	A1
Filing date	Mar 28, 2014
Priority date	Mar 28, 2014
Publication date	Mar 9, 2017
Grant date	—

Abstract

A power conversion apparatus includes: a circuit body including a switching device; a base member forming a first concave portion and a cooling surface; and a wedge inserted in the first concave portion of the base member. The first concave portion of the base member is formed by a substrate portion forming the cooling surface, a first wall disposed on the opposite side of the substrate portion from the cooling surface, and an intermediate portion interconnecting the first wall and the substrate portion. The first wall forms an insertion space for insertion of the wedge, and a heat transfer plane forming a heat dissipating surface and a heat transfer path of the circuit body. The intermediate portion is plastically deformed by inserting the wedge into the insertion space, thus causing the first wall to be displaced toward the location of the circuit body.

First claim

1 . A power conversion apparatus comprising:
a circuit body including a switching device; a base member forming a first concave portion and a cooling surface, and a wedge inserted in the first concave portion of the base member, wherein the first concave portion of the base member is formed by: a substrate portion forming the cooling surface; a first wall disposed on the opposite side of the substrate portion from the cooling surface; and an intermediate portion interconnecting the first wall and the substrate portion, the first wall forms an insertion space for insertion of the wedge, and a heat transfer plane forming a heat dissipating surface and a heat transfer path of the circuit body, and the intermediate portion is plastically deformed by inserting the wedge into the insertion space, thus causing the first wall to be displaced toward the location of the circuit body.

2 . The power conversion apparatus according to claim 1 , wherein
the base member has the substrate portion, the first wall and the intermediate portion integrally formed from the same material by pultrusion molding or extrusion molding, and the intermediate portion is continuously formed from one end to the other end of the first wall in the pultrusion direction or extrusion direction.

3 . The power conversion apparatus according to claim 1 , wherein
the wedge is configured of a first wedge and a second wedge, a surface of the first wedge that is opposed to the second wedge is defined as a first surface, and a surface of the second wedge that is opposed to the first wedge is defined as a second surface, and the first wedge and the second wedge are formed in a manner that an inclination angle of the first surface to the heat dissipating surface of the circuit body is in inverted relation to an inclination angle of the second surface to the heat dissipating surface of the circuit body.

4 . The power conversion apparatus according to claim 1 , wherein
the wedge is configured of a first wedge, a second wedge, and a third wedge interposed between the first wedge and the second wedge, and the first wedge and the second wedge are pressed against an inside wall forming the insertion space by inserting the third wedge.

5 . The power conversion apparatus according to claim 1 , wherein
the base member includes second walls opposed to the first walls with the circuit bodies interposed therebetween, and the second wall is not formed with the insertion space for insertion of the wedge.

6 . The power conversion apparatus according to claim 1 ,
further comprising a cooling body thermally connected to the cooling surface of the substrate portion, wherein the substrate portion includes a third wall formed in parallel to the cooling surface and fixed to the cooling body.

7 . The power conversion apparatus according to claim 1 , wherein
an air-cooling fin is formed integrally with the substrate portion forming the cooling surface, and formed from the same material.

8 . The power conversion apparatus according to claim 1 , wherein
the substrate portion is formed with a flow passage for running a cooling medium.

9 . The power conversion apparatus according to claim 1 , wherein
the first wall is formed with a flow passage for running a cooling medium.

10 . The power conversion apparatus according to claim 1 , further comprising:
a bus bar for carrying current to the circuit body; and a resin support portion supported by the base member, wherein the bus bar is supported by the resin support portion.

11 . The power conversion apparatus according to claim 1 , further comprising a gel material for covering the wedge and the first wall.

Assignees

• Hitachi Ltd

Inventors

• Ide Eiichi
• Shintani Hiroshi
• Tanie Hisashi

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/138

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title