Device faraday cage

Patent metadata

Field	Value
Publication number	US-2017052575-A1
Application number	US-201514828400-A
Country	US
Kind code	A1
Filing date	Aug 17, 2015
Priority date	Aug 17, 2015
Publication date	Feb 23, 2017
Grant date	—

Abstract

The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.

First claim

1 . A device, comprising:
a circuit board that includes a heat generating component; a thermal module positioned over the heat generating component; an electrically conductive structure positioned under the heat generating component; and, a biasing sub-assembly that physically biases the thermal module toward the heat generating component and that operates cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component, wherein the thermal module and the electrically conductive structure form generally parallel planar surfaces of the Faraday cage and wherein the biasing sub-assembly forms at least a portion of the Faraday cage between the generally parallel planar surfaces.

2 . The device of claim 1 , wherein the heat generating component comprises a processor, and/or memory, and wherein the device includes an antenna that is positioned outside of the Faraday cage, and wherein the Faraday cage protects the antenna from RF energy generated by the heat generating component.

3 . The device of claim 1 , wherein the thermal module comprises a vapor chamber, a heat pipe, a heat spreader, or a heat sink.

4 . The device of claim 1 , wherein the biasing sub-assembly comprises a spring.

5 . The device of claim 1 , wherein the biasing sub-assembly comprises a first type spring component and a second type spring component or wherein the biasing sub-assembly comprises a single type spring component.

6 . The device of claim 1 , wherein the electrically conductive structure is incorporated into the circuit board or wherein the electrically conductive structure is external to the circuit board.

7 . The device of claim 1 , wherein the biasing sub-assembly directly physically contacts the thermal module or wherein the biasing sub-assembly indirectly physically interacts with the thermal module.

8 . The device of claim 7 , wherein the biasing sub-assembly directly physically contacts an engagement frame secured to the thermal module.

9 . (canceled)

10 . The device of claim 1 , wherein the biasing sub-assembly completes the Faraday cage between the generally parallel planar surfaces.

11 . The device of claim 1 , wherein the biasing sub-assembly contacts a perimeter of the thermal module.

12 . A device, comprising:
a circuit board that includes a heat generating component; a thermal module positioned over the heat generating component; an electrically conductive structure positioned under the heat generating component; and, a biasing sub-assembly that physically biases the thermal module toward the heat generating component and that operates cooperatively with the thermal module and the electrically conductive structure to form a Faraday cage around the heat generating component, wherein the biasing sub-assembly defines openings that facilitate airflow between the thermal module and the circuit board and wherein a maximum dimension of the openings is less than a wavelength of radio frequency energy that the Faraday cage is configured to shield from the heat generating component.

13 . The device of claim 12 , wherein the maximum dimension is about 2.5 millimeters or less.

14 . A device, comprising:
a circuit board having a processor; and, a Faraday cage formed around the processor, at least one portion of the Faraday cage comprising a thermal module and another portion of the Faraday cage comprising a biasing sub-assembly that biases the thermal module toward the processor, the biasing sub-assembly being secured directly to the circuit board.

15 . The device of claim 14 , wherein the biasing sub-assembly comprises at least a first type spring component that forces the thermal module and the processor toward one another.

16 . The device of claim 15 , wherein the first type spring component forces the thermal module and the processor toward one another through a range of distances.

17 . The device of claim 14 , wherein the biasing sub-assembly forces the thermal module and the processor into direct physical contact with one another.

18 . The device of claim 14 , wherein the Faraday cage comprises two generally parallel spaced apart surfaces and wherein the biasing sub-assembly extends between the two generally parallel spaced apart surfaces.

19 . A device, comprising:
a shielded and cooled circuit board including a biasing sub-assembly that biases a heat generating component and a thermal module together and wherein the biasing sub-assembly further comprises a portion of a Faraday cage around the heat generating component.

20 . The device of claim 19 , wherein the biasing sub-assembly is secured relative to the heat generating component and comprises a first type spring component that is resiliently biased over the thermal module to bias the heat generating component and the thermal module together.

21 . The device of claim 20 , wherein the resilient bias of the biasing sub-assembly over the thermal module can be temporarily overcome to separate the heat generating component and the thermal module.

22 . The device of claim 19 , wherein the biasing sub-assembly is secured relative to the thermal module and comprises a first type spring component that is resiliently biased over the heat generating component to bias the heat generating component and the thermal module together.

23 . The device of claim 19 , wherein the thermal module comprises a vapor chamber, a heat pipe, or a heat spreader.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Stellman Taylor
• Buxton Bert B
• Thome Nathan M

Classifications

• H05K9/0035

  with retainers mounted beforehand on the PCB, e.g. clips · CPC title

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• G06F1/1658

  related to the mounting of internal components, e.g. disc drive or any other functional module · CPC title

• G06F1/1626

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title