Integrated Components Which Have Both Horizontally-Oriented Transistors and Vertically-Oriented Transistors
US-2024306399-A1 · Sep 12, 2024 · US
US2017040310A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017040310-A1 |
| Application number | US-201615299282-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 20, 2016 |
| Priority date | Jul 30, 2013 |
| Publication date | Feb 9, 2017 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor device includes a semiconductor substrate having a core device and an IO device. The core device includes a gate interface layer and a high-k dielectric layer on the gate interface layer. The IO device includes a gate interface layer and a high-k dielectric layer on the gate interface layer. The gate interface layer of the core device and the gate interface layer of the IO device each are doped with fluoride ions
Opening claim text (preview).
What is claimed is: 1 . A semiconductor device comprising: a semiconductor substrate having a core device and an IO device, the core device comprising a gate interface layer and a high-k dielectric layer on the gate interface layer, the IO device comprising a gate interface layer and a high-k dielectric layer on the gate interface layer, wherein the gate interface layer of the core device and the gate interface layer of the IO device each are doped with fluoride ions, and wherein the high-k dielectric layer of the core device and the high-k dielectric layer of the IO device each are doped with fluoride ions. 2 . The semiconductor device of claim 1 , wherein the high-k dielectric layer of the core device and the high-k dielectric layer of the IO device each have a U-shaped cross-section. 3 . The semiconductor device of claim 1 , further comprising: a work function on the high-k dielectric layer of the core device and a metal gate on the work function; and a work function on the high-k dielectric layer of the IO device and a metal gate on the work function.
with substrate doping, e.g. N, Ge or C implantation, before formation of the insulator · CPC title
with a treatment, e.g. annealing, after the formation of the conductor · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.