Electronic component-use package and piezoelectric device

Patent metadata

Field	Value
Publication number	US-2017034914-A1
Application number	US-201415106119-A
Country	US
Kind code	A1
Filing date	Dec 5, 2014
Priority date	Dec 19, 2013
Publication date	Feb 2, 2017
Grant date	—

Abstract

An electronic component-use package includes a base that holds an electronic component element, and terminal electrodes formed on a bottom surface of the base. The terminal electrodes have chamfered parts facing corner parts of the base bottom surface and having angles of chamfer ranging in ±10 degrees to a reference line. The reference line is a perpendicular line to a straight line that connects the corner parts of the base bottom surface to a central part on one side of the terminal electrode in proximity to a center point of the base bottom surface, the reference line L 8 passing through the chamfered parts.

First claim

1 . An electronic component-use package, comprising at least a base that holds an electronic component element, the electronic component-use package further comprising a terminal electrode disposed on a bottom surface of the base, the terminal electrode being electrically connected to a circuit board externally provided, wherein
the terminal electrode has a chamfered part facing a corner part of the bottom surface of the base and having an angle of chamfer ranging in ±10 degrees to a reference line, and the reference line is a perpendicular line to a straight line that connects the corner parts of the bottom surface of the base to a central part on one side of the terminal electrode in proximity to a center point of the bottom surface of the base, the reference line passing through the chamfered part of the terminal electrode.

2 . The electronic component-use package as claimed in claim 1 , wherein
a bump including a metal film is integrally formed on the terminal electrode, and the bump has a chamfered part facing the corner part of the bottom surface of the base, the chamfered part of the bump has an angle of chamfer ranging in ±10 degrees to a reference line for bump, and the reference line for bump is a perpendicular line to a straight line that connects the corner part of the bottom surface of the base to the central part on the one side of the terminal electrode in proximity to the center point of the bottom surface of the base, the reference line passing through the chamfered part of the bump.

3 . The electronic component-use package as claimed in claim 2 , wherein
the chamfered parts of the terminal electrode and of the bump both have a planar shape and have equal angles of chamfer.

4 . The electronic component-use package as claimed in claim 1 , wherein
the angle of chamfer ranges in ±5 degrees.

5 . The electronic component-use package as claimed in claim 1 , wherein
the terminal electrode has the chamfered parts facing corner parts at both ends on one side of the bottom surface of the base, a castellation vertically extending is formed on a side surface of the base corresponding to the one side of the bottom surface of the base, the castellation has a side surface electrode formed in continuity with the terminal electrode, and the castellation has an opening width small enough to fall between points of intersection at which extension lines respectively along directions of chamfer of the chamfered parts of the terminal electrode intersect with the one side of the bottom surface of the base.

6 . The electronic component-use package as claimed in claim 2 , wherein
the terminal electrode has the chamfered parts facing corner parts at both ends on one side of the bottom surface of the base, a castellation vertically extending is formed on a side surface of the base corresponding to the one side of the bottom surface of the base, the castellation has a side surface electrode formed in continuity with the terminal electrode, and the castellation has an opening width small enough to fall between points of intersection at which extension lines respectively along directions of chamfer of the chamfered parts of the terminal electrode intersect with the one side of the bottom surface of the base.

7 . The electronic component-use package as claimed in claim 3 , wherein
the terminal electrode has the chamfered parts facing corner parts at both ends on one side of the bottom surface of the base, a castellation vertically extending is formed on a side surface of the base corresponding to the one side of the bottom surface of the base, the castellation has a side surface electrode formed in continuity with the terminal electrode, and the castellation has an opening width small enough to fall between points of intersection at which extension lines respectively along directions of chamfer of the chamfered parts of the terminal electrode intersect with the one side of the bottom surface of the base.

8 . The electronic component-use package as claimed in claim 5 , wherein
the bottom surface of the base has a rectangular shape in plan view and a pair of opposing sides including the one side, a pair of the terminal electrodes is formed along the pair of opposing sides of the bottom surface of the base, and the castellations vertically extending are formed on both side surfaces of the base corresponding to the pair of opposing sides of the bottom surface of the base.

9 . The electronic component-use package as claimed in claim 5 , further comprising a lid for hermetical seal of an upper opening of the base, wherein
the base has a multilayered structure including a plurality of layers vertically stacked on each other, and the castellation has a smaller opening size in at least an uppermost one of the plurality of layers of the base than in the other ones of the plurality of layers.

10 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 1 ; and a piezoelectric vibration piece as the electronic component element.

11 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 2 ; and a piezoelectric vibration piece as the electronic component element.

12 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 3 ; and a piezoelectric vibration piece as the electronic component element.

13 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 4 ; and a piezoelectric vibration piece as the electronic component element.

14 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 5 ; and a piezoelectric vibration piece as the electronic component element.

15 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 6 ; and a piezoelectric vibration piece as the electronic component element.

16 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 7 ; and a piezoelectric vibration piece as the electronic component element.

17 . A piezoelectric device, comprising:
the electronic component-use package as claimed in claim 8 ; and a piezoelectric vibration piece as the electronic component element.

Assignees

• Daishinku Corp

Inventors

• Nakanishi Kentaro
• Matsuo Ryuji
• Kojyo Yuka

Classifications

• H10W70/657

  on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H03H9/1014 Primary

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title

• H03H9/1021

  the BAW device being of the cantilever type · CPC title

• H03H9/09

  Elastic or damping supports · CPC title