Tooling and a method for weakening an outline in a thin plastics card

Patent metadata

Field	Value
Publication number	US-2016368161-A1
Application number	US-201414902142-A
Country	US
Kind code	A1
Filing date	Jun 25, 2014
Priority date	Jul 1, 2013
Publication date	Dec 22, 2016
Grant date	—

Abstract

Disclosed are a method of weakening an outline in a thin plastic card and tooling for performing the method. The method may include several operations, including a go punching step by means of a go punch presenting a solid shape substantially identical to the outline and suitable for punching the thin plastic card along a go direction against a die presenting a hollow shape substantially identical to the outline and in alignment with the go punch in order to be able to receive material pushed by the go punch, and a return punching step by means of a return punch presenting a solid shape substantially identical to the outline in alignment with the go punch and suitable for punching the thin plastic card along a return direction opposite to the go direction. Also disclosed is a thin plastic card including at least one outline weakened by such a method.

First claim

1 . A method of weakening an outline in a thin plastic card, wherein the method comprises:
a go punching step by means of a go punch presenting a solid shape substantially identical to the outline and suitable for punching the thin plastic card along a go direction against a die presenting a hollow shape substantially identical to the outline and in alignment with the go punch in order to be able to receive material pushed by the go punch; and a return punching step by means of a return punch presenting a solid shape substantially identical to the outline in alignment with the go punch and suitable for punching the thin plastic card along a return direction opposite to the go direction.

2 . The method according to claim 1 , wherein a return stroke of the return punch is substantially equal to a go stroke of the go punch.

3 . The method according to claim 1 , wherein the sum of a go stroke of the go punch plus a return stroke of the return punch is less than the thickness of the thin plastic card so as to leave remaining a residual thickness of intact material.

4 . The method according to claim 1 , wherein the difference between a thickness of the thin plastic card and the sum of a go stroke of the go punch plus a return stroke of the return punch lies in the range 5% to 100% of the thickness of the thin plastic card.

5 . The method according to claim 1 , wherein the return punch includes return means loaded by thrust from the return punch along the go direction so as to urge the return punch along the return direction when the thrust ceases.

6 . The method according to claim 1 , further including a step of making a relaxation cut arranged in the proximity of the outline and suitable for deforming so as to release stresses created by the go and return punching steps.

7 . The method according to claim 1 , further comprising weakening at least one second outline by:
a second go punching step by means of a second go punch presenting a solid shape substantially identical to the at least one second outline and suitable for punching the thin plastic card in a second go direction against a second die presenting a hollow shape substantially identical to the at least one second outline and in alignment with the second go punch in order to be capable of receiving material pushed by the second go punch; and a second return punching step by means of a second return punch presenting a solid shape substantially identical to the at least one second outline in alignment with the second go punch and suitable for punching the thin plastic card along a second return direction opposite to the second go direction.

8 . The method according to claim 7 , wherein the second go direction is identical to the go direction.

9 . The method according to claim 7 , wherein the second go direction is identical to the return direction.

10 . The method according to claim 7 , wherein the at least one second outline circumscribes the outline.

11 . The method according to claim 7 , wherein the distance between the outline and the at least one second outline is greater than or equal to 300 μm.

12 . Tooling suitable for performing the method according to claim 1 in order to weaken the outline in the thin plastic card.

13 . A thin plastic card including the outline weakened by the method according to claim 1 .

14 . The thin plastic card according to claim 13 , wherein an outer profile of the outline after breaking material of a residual thickness presents a substantially flared shape opening out facing the go direction.

15 . The thin plastic card according to claim 14 , wherein said substantially flared shape presents a mean slope relative to the normal lying in the range 1° to 10°, and preferably in the range 4° to 8°.

16 . The thin plastic card according to claim 13 , wherein an inner profile of the outline after breaking material of a residual thickness presents a shape that is substantially S-shaped.

Assignees

• Oberthur Technologies

Inventors

• Bosquet Olivier
• Simmoneaux Gregory

Classifications

• G06K19/07739

  comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor · CPC title

• B26D3/085

  On sheet material · CPC title

• B26F3/002 Primary

  Precutting and tensioning or breaking · CPC title

• B26F1/40

  using a press, e.g. of the ram type (presses in general B30B) · CPC title