Single layer capacitive touch sensor
US-9524066-B2 · Dec 20, 2016 · US
US2016363433A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016363433-A1 |
| Application number | US-201615179189-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 10, 2016 |
| Priority date | Jun 11, 2015 |
| Publication date | Dec 15, 2016 |
| Grant date | — |
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Electrostatic capacitance can be measured with high directivity in a specific direction. A sensor chip that measures the electrostatic capacitance includes a first electrode, a second electrode and a third electrode. The first electrode has a first portion. The second electrode has a second portion extended on the first portion of the first electrode, and is insulated from the first electrode within the sensor chip. The third electrode has a front face extended in a direction which intersects with the first portion of the first electrode and the second portion of the second electrode, and is provided on the first portion and the second portion. The third electrode is insulated from the first electrode and the second electrode within the sensor chip.
Opening claim text (preview).
We claim: 1 . A sensor chip that measures electrostatic capacitance, comprising: a first electrode having a first portion; a second electrode, having a second portion extended on the first portion, insulated from the first electrode within the sensor chip; and a third electrode, having a front face extended in a direction which intersects with the first portion and the second portion, provided on the first portion and the second portion and insulated from the first electrode and the second electrode within the sensor chip. 2 . The sensor chip of claim 1 , wherein the first electrode and the second electrode are opened toward a side of a region where the front face of the third electrode is provided, and the first electrode and the second electrode are extended to surround the third electrode. 3 . The sensor chip of claim 1 , further comprising: an end face, wherein the end face is a curved surface having a preset curvature, and the front face of the third electrode is extended along the end face. 4 . The sensor chip of claim 1 , further comprising: a substrate member which has a surface including a front face and a bottom face, and is insulated on the surface, wherein the third electrode is extended along the front face of the substrate member, and the second portion of the second electrode is extended along the bottom face of the substrate member. 5 . The sensor chip of claim 4 , wherein the substrate member is made of an insulating material. 6 . The sensor chip of claim 5 , wherein the insulating material is borosilicate glass, silicon nitride, quartz or aluminum oxide. 7 . A measuring device of measuring electrostatic capacitance, comprising: a base substrate; sensor chips arranged along an edge of the base substrate, each of the sensor chips being a sensor chip as claimed in claim 1 ; and a circuit board mounted on the base substrate, wherein the circuit board comprises: a ground potential line allowed to be electrically connected to the first electrode; a high frequency oscillator configured to generate a high frequency signal and electrically connected to the second electrode and the third electrode; a C/V conversion circuit configured to convert a voltage amplitude in the third electrode of each of the sensor chips into a voltage signal indicating the electrostatic capacitance; and an A/D converter configured to convert the voltage signal output from the C/V conversion circuit to a digital value. 8 . The measuring device of claim 7 , wherein the circuit board further comprises: a storage device configured to store therein the digital value; and a communication device configured to wirelessly transmit the digital value stored in the storage device. 9 . The measuring device of claim 7 , wherein the circuit board further comprises a switch configured to connect the first electrode to the ground potential line selectively. 10 . The measuring device of claim 7 , wherein the base substrate has a disk shape, each of the sensor chips is a sensor chip as claimed in claim 3 , and the end face of each of the sensor chips is provided along the edge of the base substrate.
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