Method for metallizing dielectric substrate surface, and dielectric substrate provided with metal film

Patent metadata

Field	Value
Publication number	US-2016362791-A1
Application number	US-201515121524-A
Country	US
Kind code	A1
Filing date	Feb 24, 2015
Priority date	Feb 28, 2014
Publication date	Dec 15, 2016
Grant date	—

Abstract

A method includes:generating a peroxide radical on a dielectric substrate surface by treating the dielectric substrate surface with atmospheric pressure plasma using a rare gas; fixing a functional group forming a coordinate bond with a silver ion, by reacting a grafting agent; and applying a silver-containing composition to the substrate surface, followed by heating and curing the silver-containing composition, to thereby form a silver thin film layer, the silver-containing composition containing a silver compound (A) represented by Formula (1) and an amine compound (B) represented by Formula (2), the silver compound (A) being contained in an amount of 10 to 50% by mass, the amine compound (B) being contained in an amount of 50 to 90% by mass, relative to a total amount of 100% by mass of the silver compound (A) and the amine compound (B).The method enables to form a metal film having high adhesiveness even on the surface of a fluorine resin, which is suitable as a dielectric substrate due to its property of avoidance of delay in signal transmission speed or increase in power consumption, but has extremely low adhesiveness.

(R 1 ; a hydrogen atom, —(CY 2 )a-CH 3 , or —((CH 2 )b-O—CHZ)c-CH 3 ; R 2 : —(CY 2 )d-CH 3 or —((CH 2 )e-O—CHZ)f-CH 3 ; Y: a hydrogen atom or —(CH 2 )g-CH 3 ; Z: a hydrogen atom or —(CH 2 )h-CH 3 ; a: an integer of 0 to 8; b: an integer of 1 to 4; c: an integer of 1 to 3; d: an integer of 1 to 8; e: an integer of 1 to 4; f: an integer of 1 to 3; g: an integer of 1 to 3; h: an integer of 1 or 2)

First claim

1 . A method for metallizing a dielectric substrate surface, the method comprising:
generating a peroxide radical on a dielectric substrate surface by treating the dielectric substrate surface with atmospheric pressure plasma using a rare gas; fixing a functional group forming a coordinate bond with a silver ion, by reacting a grafting agent on the substrate surface having the peroxide radical; and applying a silver-containing composition to the substrate surface on which the functional group forming the coordinate bond with the silver ion is fixed, followed by heating and curing the silver-containing composition, to thereby form a silver thin film layer, the silver-containing composition containing a silver compound (A) represented by Formula (1) and an amine compound (B) represented by Formula (2), the silver compound (A) being contained in an amount of 10 to 50% by mass, the amine compound (B) being contained in an amount of 50 to 90% by mass, relative to a total amount of 100% by mass of the silver compound (A) and the amine compound (B)

(R 1 is a hydrogen atom, —(CY 2 )a-CH 3 , or —((CH 2 )b-O—CHZ)c-CH 3 ; R 2 is —(CY 2 )d-CH 3 or —((CH 2 )e-O—CHZ)f-CH 3 ; Y is a hydrogen atom or —(CH 2 )g-CH 3 ; Z is a hydrogen atom or —(CH 2 )h-CH 3 ; a is an integer of 0 to 8; b is an integer of 1 to 4; c is an integer of 1 to 3; d is an integer of 1 to 8; e is an integer of 1 to 4; f is an integer of 1 to 3; g is an integer of 1 to 3; and h is an integer of 1 or 2).

2 . The method for metallizing a dielectric substrate surface according to claim 1 , wherein the silver-containing composition contains the silver compound (A) and the amine compound (B) in an amount of 20 to 80% by mass and a solvent in an amount of 20 to 80% by mass.

3 . The method for metallizing a dielectric substrate surface according to claim 1 , wherein the dielectric substrate is a fluorine-containing polymer resin, a polymer alloy or a copolymer of a fluorine-containing polymer resin with a liquid crystalline polymer represented by a polyester, or, a polymer alloy or a copolymer of a fluorine-containing polymer resin with a polyimide dielectric.

4 . The method for metallizing a dielectric substrate surface according to claim 1 , wherein the dielectric substrate is polytetrafluoroethylene.

5 . The method for metallizing a dielectric substrate surface according to claim 1 , wherein the grafting agent is composed of a complexing compound and/or a complexing polymer, containing a functional group that includes an atomic group containing at least one selected from the group consisting of N, P, and S and that forms a coordinate bond with a silver ion.

6 . The method for metallizing a dielectric substrate surface according to claim 5 , wherein the complexing compound is at least one compound selected from the group consisting of vinylamines, acrylamide, acrylonitrile, vinylanilines, vinylisocyanates, vinylpyrroles, vinylpyrrolidones, vinyltriazines, vinylphosphonic acids, vinylphosphoric acids, vinylthiols, vinylthiophenes, and vinylsulfonic acids, and the complexing polymer is at least one polymer compound including polymers of the complexing compounds.

7 . The method for metallizing a dielectric substrate surface according to claim 1 , wherein the grafting agent and the silver-containing composition are applied by any liquid method of spin coating, spraying, inkjet printing, offset printing, gravure offset printing, immersing, and doctor blade coating.

8 . A dielectric substrate with a metal film, wherein a silver thin film layer is formed on the dielectric substrate by the method for metallizing a dielectric substrate surface according to claim 1 .

Assignees

• Univ Osaka
• Nof Corp

Inventors

• Yamamura Kazuya
• Ohkubo Yuji
• SATO Haruka
• Hikita Masaya

Classifications

• C08J7/0423

  with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder · CPC title

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08J2327/18

  Homopolymers or copolymers of tetrafluoroethylene · CPC title

• C08J2433/14

  of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen · CPC title

• C08J2345/00

  Characterised by the use of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Derivatives of such polymers · CPC title