Method for metallizing dielectric substrate surface, and dielectric substrate provided with metal film
US-2016362791-A1 · Dec 15, 2016 · US
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Patent family 54008993
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 54008993 |
| Family type | — |
| Earliest priority | Feb 28, 2014 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2016362791A1 — Method for metallizing dielectric substrate surface, and dielectric substrate provided with metal film |
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US2016362791A1 — Method for metallizing dielectric substrate surface, and dielectric substrate provided with metal film (published Dec 15, 2016)
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