High thermal conductivity wafer support pedestal device

Patent metadata

Field	Value
Publication number	US-2016358761-A1
Application number	US-201615173832-A
Country	US
Kind code	A1
Filing date	Jun 6, 2016
Priority date	Jun 5, 2015
Publication date	Dec 8, 2016
Grant date	—

Abstract

A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.

First claim

What is claimed is:

1 . A support pedestal device for an electrostatic chuck comprising:
a base housing defining an internal cavity; a base insert disposed within the internal cavity of the base housing; and at least one fluid pathway disposed within the internal cavity, the fluid pathway defining: a plurality of linear-parallel cooling channels separated by a corresponding plurality of linear-parallel cooling fins; a fluid supply channel; and a fluid return channel, wherein a cooling fluid is able to flow through the fluid pathway by passing through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.

2 . The support pedestal device according to claim 1 , wherein the linear-parallel cooling fins are a part of the base insert.

3 . The support pedestal device according to claim 1 , wherein the linear-parallel cooling fins are a part of the base housing.

4 . The support pedestal device according to claim 1 , wherein a first fluid pathway is formed in the base insert and a second fluid pathway is formed in the base housing, wherein each fluid pathway defines a plurality of linear-parallel cooling channels separated by a corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel, wherein the linear-parallel cooling fins are a part of the base housing and the base insert.

5 . The support pedestal device according to claim 1 , wherein the base housing and the base insert are separate components.

6 . The support pedestal device according to claim 1 further comprising a plurality of electrode feed-throughs extending through the base housing and the base insert.

7 . The support pedestal device according to claim 6 further comprising a plurality of spacers disposed within recesses formed in either the base housing or the base insert, wherein the electrode feed-throughs extend through the spacers.

8 . The support pedestal device according to claim 1 , wherein the fluid supply channel extends radially from a central portion, in a direction parallel to the cooling channels, and then bi-circumferentially around an outer periphery of the fluid pathway.

9 . The support pedestal device according to claim 1 , wherein the fluid return channel extends bi-circumferentially and then radially to a central portion, in a direction parallel to the cooling channels of the fluid pathway.

10 . The support pedestal device according to claim 1 , wherein a fluid inlet and a fluid outlet are formed around a peripheral area of the support pedestal device

11 . The support pedestal device according to claim 1 , wherein the base insert comprises a lower radial flange defining an outer face that abuts an inner side surface of the internal cavity of the base housing.

12 . The support pedestal device according to claim 1 , wherein the plurality of cooling channels define the same cross-sectional area.

13 . The support pedestal device according to claim 12 , wherein the cooling channels define an aspect ratio of about 10:1.

14 . The support pedestal device according to claim 1 , wherein the device defines a thermal resistance of 0.000171° C./w or less.

15 . The support pedestal device according to claim 1 , wherein an interface between the base housing and the base insert is planar.

16 . The support pedestal device according to claim 1 , wherein the linear-parallel cooling fins define a spacing and geometry to provide zones of different thermal conductivity across the support pedestal device.

17 . A support pedestal device for an electrostatic chuck comprising:
a plurality of linear-parallel cooling channels separated by a corresponding plurality of linear-parallel cooling fins; a fluid supply channel; and a fluid return channel, wherein a cooling fluid flows through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.

18 . The support pedestal device according to claim 17 , wherein the cooling channels and the fluid supply and return channels are internal to the support pedestal device.

19 . A method of improving thermal conductivity and reducing thermal mass of a wafer support pedestal comprising:
directing a cooling fluid through a fluid supply channel to a central portion of the wafer support pedestal; directing the cooling fluid outward radially; directing the cooling fluid bi-circumferentially; directing the cooling fluid through linear-parallel cooling channels; directing the cooling fluid bi-circumferentially; and directing the cooing fluid inward radially through a fluid return channel to the central portion of the wafer support pedestal.

20 . The method according to claim 19 , wherein the cooling fluid is a two-phase fluid.

Assignees

• Watlow Electric Mfg

Inventors

• Atlas Boris
• Nosrati Mohammad
• Smith Kevin R
• Ames Ken
• Ptasienski Kevin

Classifications

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H01J2237/334

  Etching · CPC title

• H01J37/32697

  Electrostatic control · CPC title

• H01J2237/2001

  Maintaining constant desired temperature · CPC title

• H01J2237/2007

  Holding mechanisms · CPC title