High thermal conductivity wafer support pedestal device
US-2016358761-A1 · Dec 8, 2016 · US
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Patent family 56194574
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 56194574 |
| Family type | — |
| Earliest priority | Jun 5, 2015 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2016358761A1 — High thermal conductivity wafer support pedestal device |
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US2016358761A1 — High thermal conductivity wafer support pedestal device (published Dec 8, 2016)
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