Reverse conducting igbt

Patent metadata

Field	Value
Publication number	US-2016351561-A1
Application number	US-201615095458-A
Country	US
Kind code	A1
Filing date	Apr 11, 2016
Priority date	May 27, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

A reverse conducting IGBT is provided with a trench gate member that is provided in an IGBT region and has a lattice-pattern layout, and a trench member that is provided in a diode region and has a stripe-pattern layout. The diode region of the semiconductor substrate includes an anode region of a first conductive type, a drift region of a second conductive type and a barrier region of the second conductive type. The barrier region is electrically connected to a top surface electrode via a pillar member that extends from a top surface of the semiconductor substrate.

First claim

What is claimed is:

1 . A reverse conducting IGBT comprising:
a semiconductor substrate partitioned into an IGBT region in which an IGBT structure is provided and a diode region in which a diode structure is provided; a bottom surface electrode in contact with a bottom surface of the semiconductor substrate, the bottom surface electrode being in contact with both the IGBT region and the diode region of the semiconductor substrate; a top surface electrode in contact with a top surface of the semiconductor substrate, the top surface electrode being in contact with both the IGBT region and the diode region of the semiconductor substrate; a trench gate member provided in the IGBT region of the semiconductor substrate, having a lattice-pattern layout when seen from a direction orthogonal to the top surface of the semiconductor substrate; and a trench member provided in the diode region of the semiconductor substrate, having a stripe-pattern layout when seen from the direction orthogonal to the top surface of the semiconductor substrate, wherein the trench member comprises a plurality of stripe trenches extending along a first direction, the diode region of the semiconductor substrate comprises:
an anode region of a first conductive type that is provided between adjacent stripe trenches, is exposed at the top surface of the semiconductor substrate, and is in contact with the top surface electrode;
a drill region of a second conductive type that is provided beneath the anode region;
a barrier region of the second conductive type that is provided between adjacent stripe trenches, is provided between the anode region and the drift region, has an impurity concentration which is higher than an impurity concentration of the drift region, and is electrically connected to the top surface electrode via a pillar member that extends from the top surface of the semiconductor substrate.

2 . The reverse conducting IGBT according to claim 1 , wherein
an exposed surface of the pillar member is exposed at the top surface of the semiconductor substrate and extends along the first direction.

3 . The reverse conducting IGBT according to claim 1 , wherein
exposed surfaces of the pillar member are exposed at the top surface of the semiconductor substrate, and are dispersedly arranged along the first direction.

4 . The reverse conducting IGBT according to claim 1 , wherein
the trench gate member comprises:
a plurality of first trench gates extending along the first direction; and
a plurality of second trench gates extending along a second direction orthogonal to the first direction between adjacent first trench gates.

5 . The reverse conducting IGBT according to claim 4 , wherein
a pitch length of the plurality of first trench gates in the second direction is longer than a pitch length of the plurality of stripe trenches in the second direction, and a pitch length of the plurality of second trench gates in the first direction is longer than the pitch length of the plurality of stripe trenches in the second direction.

6 . The reverse conducting IGBT according to claim 1 , further comprising:
an interlayer insulation film provided between the top surface of the semiconductor substrate and the top surface electrode, Wherein a plurality of openings is formed in the interlayer insulation film so that the top surface electrode is in contact with the top surface of the semiconductor substrate, wherein the plurality of openings of the interlayer insulation film includes openings distributed so as to correspond to top surface portions of the semiconductor substrate that are each enclosed by the lattice-patterned trench gate member, and the plurality of openings of the interlayer insulation film includes openings distributed in the first direction corresponding to a top surface portion of the semiconductor substrate between adjacent stripe trenches.

7 . The reverse conducting IGBT according claim 6 , wherein
the trench gate member comprises:
a plurality of first trench gates extending along the first direction; and
a plurality of second trench gates extending along a second direction orthogonal to the first direction between adjacent first trench gates,
a pitch length of the plurality of first trench gates in the second direction is equal to a pitch length of the plurality of stripe trenches in the second direction, and a pitch length of the plurality of second trench gates in the first direction is equal to the pitch length of the plurality of stripe trenches in the second direction.

8 . The reverse conducting IGBT according to claim 6 , wherein
the trench gate member comprises:
a plurality of first trench gates extending along the first direction; and
a plurality of second trench gates extending along a second direction orthogonal to the first direction between adjacent first trench gates,
the plurality of first trench gates has a pitch length, in the second direction, and the plurality of second trench gates has a. pitch length in the first direction, and one of the pitch lengths is equal to a pitch length of the plurality of stripe trenches in the second direction, and the other of the pitch lengths is longer than the pitch length of the plurality of stripe trenches in the second direction,

9 . The reverse conducting IGBT according to claim 8 , wherein
the pitch length of the plurality of first trench gates in the second direction is equal to the pitch length of the plurality of stripe trenches in the second direction, and the pitch length of the plurality of second trench gates in the first direction is longer than the pitch length of the plurality of stripe trenches in the second direction.

Assignees

• Toyota Motor Co Ltd

Inventors

• Senoo Masaru

Classifications

• H10D30/0297

  using recessing of the gate electrodes, e.g. to form trench gate electrodes · CPC title

• H10D12/01

  Manufacture or treatment · CPC title

• H10D8/01

  Manufacture or treatment · CPC title

• H10D64/513

  within recesses in the substrate, e.g. trench gates, groove gates or buried gates · CPC title

• H10D12/411 Primary

  Insulated-gate bipolar transistors [IGBT] · CPC title