Semiconductor device

Patent metadata

Field	Value
Publication number	US-2016351469-A1
Application number	US-201615160155-A
Country	US
Kind code	A1
Filing date	May 20, 2016
Priority date	May 28, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

In a semiconductor device, a first to a sixth switching elements are joined to a second main surface of a substrate with their electrode surfaces facing the second main surface of the substrate. Non-electrode surfaces of the switching elements are provided with respective heat spreaders joined thereto. Each of the heat spreaders is constituted of a heat spreader main body and a pair of standing portions. The heat spreader main body is formed in a cuboid having rectangular flat surfaces that are elongated in one direction. The standing portions are standing on both edges of a surface of the heat spreader main body.

First claim

What is claimed is:

1 . A semiconductor device comprising:
a substrate having a first main surface and a second main surface; a switching element that has an electrode surface on which a plurality of electrodes are provided and a non-electrode surface opposite to the electrode surface and provided with no electrodes, and that is a horizontal semiconductor element joined to the substrate with the electrode surface facing the second main surface of the substrate; and a heat spreader joined to the non-electrode surface of the switching element, wherein the heat spreader has a gap determination portion that determines a gap between the heat spreader and the substrate.

2 . The semiconductor device according to claim 1 , further comprising a heat sink joined to a surface of the heat spreader that is opposite to a surface of the heat spreader joined to the switching element.

3 . The semiconductor device according to claim 1 , wherein
the switching element includes a plurality of switching elements, and the switching elements are each provided with the heat spreader.

4 . The semiconductor device according to claim 1 , further comprising a sealing resin that seals the switching element and the heat spreader, except a portion of the heat spreader including the surface of the heat spreader that is opposite to the surface joined to the switching element.

Assignees

• Jtekt Corp

Inventors

• Hieda Takahito
• Nakai Motoo
• Uchida Nobuhiro
• Tani Naoki

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W40/77

  Auxiliary members characterised by their shape · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title